Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules

Microelectronics Reliability

Volumn 41, Issue 9-10, 2001, Pages 1643-1648

  Rautioaho, R ^a   Nousiainen, O ^a   Leppavuori S ^a   Lenkkeri, J ^b   Jaakola, T ^b  

^a UNIVERSITY OF OULU   (Finland)

^b VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; CRACK INITIATION; CRACK PROPAGATION; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; FATIGUE OF MATERIALS; METALLIZING; MULTILAYERS; PALLADIUM; PLATINUM; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; SILVER; THERMAL CYCLING; THERMAL EFFECTS;

LOW-TEMPERATURE COFIRED CERAMICS (LTCC); THERMAL FATIGUE;

SOLDERED JOINTS;

EID: 0035456904     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00163-9     Document Type: Article

References (8)

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