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Journal of Electronic Materials

Volumn 33, Issue 1, 2004, Pages 34-39

Reflow and Burn-in of a Sn-20ln-0.8Cu Ball Grid Array Package with a Au/Ni/Cu Pad

(3) Chiang, M J a Chang, S Y a Chuang, T H a

a NATIONAL TAIWAN UNIVERSITY (Taiwan)

Author keywords

Au Ni Cu pads; Ball grid array packages; Burn in; Reflow; Sn 20In 0.8Cu solder

Indexed keywords

ARRAYS; EMBRITTLEMENT; ENERGY DISPERSIVE SPECTROSCOPY; FRACTURE; GOLD; INTERMETALLICS; METALLIZING; PACKAGING; SCANNING ELECTRON MICROSCOPY; SHEAR STRESS; SOLDERING ALLOYS; THERMAL EFFECTS; WETTING;

AU/NI/CU PADS; BALL GRID ARRAY PACKAGES; BURN-IN TESTING; REFLOW; SN-20IN-0.8CU SOLDER;

TIN ALLOYS;

EID: 0742303044 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-004-0291-7 Document Type: Article

Times cited : (12)

References (17)

1
- 0035454941
- C.M. Liu, C.E. Ho, W.T. Chen, and C.R. Kao, J. Electron. Mater. 30, 1152 (2001).
- (2001) J. Electron. Mater. , vol.30 , pp. 1152
- Liu, C.M.¹ Ho, C.E.² Chen, W.T.³ Kao, C.R.⁴

2
- 0034944094
- K. Uenishi and T. Dseki, Mater. Trans. 42, 756 (2001).
- (2001) Mater. Trans. , vol.42 , pp. 756
- Uenishi, K.¹ Dseki, T.²

3
- 0036865876
- C.S. Huang, J.H. Yeh, B.L. Young, and J.G. Duh, J. Electron. Mater. 32, 1230 (2002).
- (2002) J. Electron. Mater. , vol.32 , pp. 1230
- Huang, C.S.¹ Yeh, J.H.² Young, B.L.³ Duh, J.G.⁴

4
- 0035455437
- J.Y. Park, C.W. Yang, J.S. Ha, C.U. Kim, E.J. Kwon, S.B. Jung, and C.S. Kang, J. Electron. Mater. 30, 1165 (2001).
- (2001) J. Electron. Mater. , vol.30 , pp. 1165
- Park, J.Y.¹ Yang, C.W.² Ha, J.S.³ Kim, C.U.⁴ Kwon, E.J.⁵ Jung, S.B.⁶ Kang, C.S.⁷

5
- 0033221504
- C.E. Ho, Y.M. Chen, and C.R. Kao, J. Electron. Mater. 28, 1231 (1999).
- (1999) J. Electron. Mater. , vol.28 , pp. 1231
- Ho, C.E.¹ Chen, Y.M.² Kao, C.R.³

6
- 0742275857
- M. Abtew and G. Selvaduray, Mater. Sci. Eng. 95, 27 (2000).
- (2000) Mater. Sci. Eng. , vol.95 , pp. 27
- Abtew, M.¹ Selvaduray, G.²

7
- 0036477472
- W.T. Chen, C.E. Ho, and C.R. Kao, J. Electron. Mater. 17, 263 (2002).
- (2002) J. Electron. Mater. , vol.17 , pp. 263
- Chen, W.T.¹ Ho, C.E.² Kao, C.R.³

8
- 0742310753
- Master's thesis, National Taiwan University, Taipei, Taiwan
- Y.M. Wang (Master's thesis, National Taiwan University, Taipei, Taiwan, 2003).
- (2003)
- Wang, Y.M.¹

9
- 0026852092
- Z. Mei and J.W. Morris, J. Electron. Mater. 21, 401 (1992).
- (1992) J. Electron. Mater. , vol.21 , pp. 401
- Mei, Z.¹ Morris, J.W.²

10
- 0026882383
- Z. Mei and J.W. Morris, J. Electron. Mater. 21, 599 (1992).
- (1992) J. Electron. Mater. , vol.21 , pp. 599
- Mei, Z.¹ Morris, J.W.²

11
- 0002266596
- D.M. Jacobson and D. Humpston, Gold Bull. 22, 9 (1989).
- (1989) Gold Bull. , vol.22 , pp. 9
- Jacobson, D.M.¹ Humpston, D.²

12
- 0742275853
- N.C. Lee, Soldering Surf. Mount Technol. 26, 25 (1997).
- (1997) Soldering Surf. Mount Technol. , vol.26 , pp. 25
- Lee, N.C.¹

13
- 0037349029
- T.H. Chuang, S.Y. Chang, L.C. Tsao, W.P. Weng, and H.M. Wu, J. Electron. Mater. 32, 195 (2003).
- (2003) J. Electron. Mater. , vol.32 , pp. 195
- Chuang, T.H.¹ Chang, S.Y.² Tsao, L.C.³ Weng, W.P.⁴ Wu, H.M.⁵

14
- 36449009293
- H.K. Kim, H.K. Liou, and K.N. Tu, Appl. Phys. Lett. 66, 2337 (1995).
- (1995) Appl. Phys. Lett. , vol.66 , pp. 2337
- Kim, H.K.¹ Liou, H.K.² Tu, K.N.³

15
- 0019008239
- S.K. Kang and V. Ramachandran, Scripta Metall. 14, 421 (1980).
- (1980) Scripta Metall. , vol.14 , pp. 421
- Kang, S.K.¹ Ramachandran, V.²

16
- 0026912216
- E.B. Hannech and C.R. Hall, Mater. Sci. Technol. 8, 817 (1992).
- (1992) Mater. Sci. Technol. , vol.8 , pp. 817
- Hannech, E.B.¹ Hall, C.R.²

17
- 0032649407
- I. Shohji, S. Fujiwara, S. Kiyono, and K.F. Kobayashi, Scripta Mater. 40, 815 (1999).
- (1999) Scripta Mater. , vol.40 , pp. 815
- Shohji, I.¹ Fujiwara, S.² Kiyono, S.³ Kobayashi, K.F.⁴

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