Excellent reliability of solder ball made of a compliant plastic core

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1345-1349

  Okinaga, N ^a   Kuroda, H ^a   Nagai, Y ^a  

^a SEKISUI CHEMICAL CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; COMPUTER SIMULATION; EPOXY RESINS; FINITE ELEMENT METHOD; RELIABILITY; SEMICONDUCTING SILICON; SOLDERED JOINTS; STRAIN; STRESS RELAXATION; SUBSTRATES; THERMAL EXPANSION; THERMAL STRESS;

BALL GRID ARRAY; COEFFICIENT OF THERMAL EXPANSION; THERMAL STRAIN;

CHIP SCALE PACKAGES;

EID: 0034823082     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. The review of micro-interconnection technology
2. Evaluation of electric properties of a single conductive fine particle