A gap reduction and manufacturing technique for thick oxide mask layers with multiple-size sub-μm openings

Journal of Microelectromechanical Systems

Volumn 15, Issue 5, 2006, Pages 1139-1144

  Abdolvand, Reza ^a   Ayazi, Farrokh ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Deep reactive ion etching (DRIE); Gap reduction; High aspect ration trench; Sub m gap

Indexed keywords

DEEP REACTIVE ION ETCHING; GAP REDUCTION; THICK OXIDE MASK LAYERS;

ASPECT RATIO; CRYSTAL RESONATORS; DRY ETCHING; LITHOGRAPHY; MASKS; REACTIVE ION ETCHING; SILICON ON INSULATOR TECHNOLOGY;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 33750006893     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2006.879668     Document Type: Article

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