Packaging trends for semiconductor lasers for DWDM-applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 1-4

  Vreeburg, C G M ^a   Groeneveld, C M ^a  

^a Uniphase Netherlands BV   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL CAPACITY; ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTRONICS PACKAGING; FIBER OPTICS; OPTICAL COMMUNICATION; SEMICONDUCTING INDIUM COMPOUNDS; SEMICONDUCTOR DEVICE MANUFACTURE; WAVELENGTH DIVISION MULTIPLEXING;

CHANNEL SPACING; FIBER PIGTAIL; FIBER TRANSMISSION SYSTEMS; POWER CONSUMPTION MANAGEMENT; STACKING DENSITY;

SEMICONDUCTOR LASERS;

EID: 0032643015     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)