Low temperature wafer-scale thin film encapsulation for RF MEMS

IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Global Business Council, GBC 2006 Spring Conference

Volumn , Issue , 2006, Pages

  Poupon, G ^a   Gillot, C ^a   Lagoutte, E ^a   Pornin, J L ^a   Sillon, N ^a  

^a DIHS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

HERMETICALLY SEALED; IC MANUFACTURING TECHNOLOGIES; LOW TEMPERATURES; RF SWITCH; SACRIFICIAL LAYER; THIN FILM ENCAPSULATION; WAFER LEVEL; WAFER-SCALE;

INTEGRATED CIRCUITS;

EXHIBITIONS;

EID: 84877078176     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. K. Najafi, Micromachining and Microfabrication Process Technology VII, Proc. Of SPIE, Vol. 4979, 2003.
2. B.H. Stark, K. Najafi, Journal of Microelectromechanical Systems, Vol. 13, No. 2, pp. 147-157, April, 2004.
3. M. Bartek, J.A. Foerster, R.F. Wolffenbuttel, Sensors and Actuators, A61, pp. 364-368, 1997.
4. C. Gillot, N. Sillon, P. Robert, E. Dahan, X. Baillin, E. Lagoutte, IMAPS International Workshop on Microelectronics, Long Beach, USA, Nov 14-18, 2004.
5. D. Saias, P. Robert, S. Boret, C. Billard, G. Bouche, D. Belot and P. Ancey, IEEE Journal of SolidState Circuits, Vol. 38, No. 12, pp. 2318-2324, December, 2003.