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Defect and Diffusion Forum

Volumn 143-147, Issue , 1997, Pages 579-584

Phase growth between copper and different tin solders

(3) Dabritz S a Bergner, D b Hoffmann, V c

a DRESDEN UNIVERSITY OF TECHNOLOGY (Germany)

b TU BERGAKADEMIE FREIBERG (Germany)

c IFW DRESDEN (Germany)

Author keywords

Ageing; Cu Sn Phase Growth; Sn Pb Solders

Indexed keywords

EID: 3042949367 PISSN: 10120386 EISSN: 16629507 Source Type: Journal
DOI: 10.4028/www.scientific.net/ddf.143-147.579 Document Type: Article

Times cited : (4)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.