An investigation of copper dissolution and the formation of intermetallic compounds in molten tin and tin-silver solders

Proceedings of the ASME Summer Heat Transfer Conference

Volumn 2003, Issue , 2003, Pages 289-294

  Faizan, M ^a   McCoy, R A ^a   Lin, D C ^b   Srivatsan, T S ^b   Wang, G X ^b  

^a YOUNGSTOWN STATE UNIVERSITY   (United States)

^b University of Akron   (United States)

Author keywords

Copper dissolution; Dipping; Intermetallic compound; Reflow; Sn Ag solder; Tin

Indexed keywords

COPPER; GRINDING (MACHINING); INTERFACES (MATERIALS); INTERMETALLICS; MICROSTRUCTURE; MOLTEN MATERIALS; REACTION KINETICS; SOLDERING ALLOYS;

COPPER DISSOLUTION; DIPPING; REFLOW; SN-AG SOLDER;

DISSOLUTION;

EID: 1842640368     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ht2003-47477     Document Type: Conference Paper

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