The technical, social, and legal outlook for lead-free solders

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 15-24

  Casey, P ^a   Pecht, M ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTELLECTUAL PROPERTY; LAWS AND LEGISLATION; MODIFIED ATMOSPHERE PACKAGING; PACKAGING MATERIALS; PATENTS AND INVENTIONS; SOLDERING ALLOYS;

INTELLECTUAL PROPERTY RIGHTS; LEAD-FREE; LEAD-FREE SOLDER COMPOSITION; POLITICAL PRESSURES; TECHNICAL DIFFICULTIES; TIN-LEAD;

LEAD-FREE SOLDERS;

EID: 84966639552     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188807     Document Type: Conference Paper

References (40)

1. R. Ciocci, "Lead-Free Solder and the Consumer Electronics Market," Proceedings of the Virginia Tech College of Engineering Green Electronics Conference, 2001.
2. P.A. Magill, et al., "Electroplating Lead-Free Solders for Flip-Chip Packaging," [Online]. Available: http://www.unitive.com/techDocumentation/docs/electro.pdf
3. D.R. Frear, J.W. Jang, J.K. Lin, and C. Zhang, "Pb-Free Solders for Flip-Chip Interconnects," Journal of Materials, vol. 53, June 2001, pp.28-32.
4. A. Gowda, K. Srihari, and A. Primavera, "Lead-Free Rework Processes for Chip Scale Packages," [Online], Available: http://www.uic.com/wcms/WCMS.nsf/index/White-Papers-5.html
5. nd Session, Vote 133, May 25, 1994.
6. Lead and Lead Compounds; Lowering of Reporting Thresholds; Community Right-to-Know Toxic Chemical Release Reporting; Final Rule. Federal Register, 66, 4499-4547 (Jan 17, 2001).
7. "Amended proposal for a Directive of the European Parliament and of the Council on Waste Electrical and Electronic Equipment," Commission of the European Communities, June 6, 2001.
8. "Proposal for a Directive of the European Parliament and of the Council on the Restriction of the Use of Certain Hazardous Materials in Electrical and Electronic Equipment, Article 3 Paragraph 5," Commission of the European Communities, June 13, 2000.
9. "Directive 2000/53/EC of the European Parliament and the Council of 18 September 2000 on End of Life Vehicles," Official Journal of the European Communities, October 21, 2000.
10. A.T. Lubrano, et al. "Low toxicity corrosion resistant solder," US Patent 4778733, Oct 18, 1988.
11. Cookson Electronics Corp.: "Partnering with the global electronics industry in the transition to lead-free joining solutions." [Online]. Available: http://www.alphametals.com/lead-free/
12. P.E. Naton, "Lead- and antimony-free solder composition," US Patent 4879096, Nov 7, 1989.
13. K.L. Tucker, et al., "Low toxicity alloy compositions for joining and sealing," US Patent 4929423, May 29, 1990.
14. N. Ryuji, et al., "Lead free soldering alloy," JP Patent 0009019790, Jan 21, 1997.
15. S. Hideyoshi, et al., "Lead free solder and packaging component using it," JP Patent 0008323495, Oct 12, 1996.
16. I.N. Walton, "Lead free solder," US Patent 6416883, July 9, 2002.
17. N. Tetsuya, et al., "Electronic component connected by lead-free solder," JP Patent 2001358456, Dec 26, 2001.
18. A.T. Lubrano, et al. "Low toxicity corrosion resistant solder," US Patent 4778733, Oct 18, 1988.
19. S. Yoshinori, et al., "Solder alloy for electrode for joining electronic component and soldering method therefore," JP Patent 0009326554, Dec 16, 1997.
20. Sohn, J. "Are Lead-Free Solder Joints Reliable?," Circuits Assembly, June 2002.
21. "Pb-Free Solder Patent Problems Finally Resolved," Nikkei Electronics Asia, April 2001.
22. S. Yoshinori, et al., "Solder alloy for electrode for joining electronic component and soldering method therefore," JP Patent 0009326554, Dec 16, 1997.
23. D. Takashi, et al., "Ag solder," JP Patent 0006269983, Sep 27, 1994.
24. D. Takashi, et al., "Ag solder," JP Patent 0006269982, Sep 27, 1994.
25. I.E. Anderson, et al., "Lead-free solder," US Patent 6231691, May 15, 2001.
26. I.E. Anderson, et al., "Pb-free Sn-Ag-Cu ternary eutectic solder," US Patent 5527628, Jun 18, 1996.
27. A. Achari, et al. "Lead-free solder compositions," US Patent 5863493, Jan 26, 1999.
28. M. Toshiitshi, et al., "Lead free solder alloy," JP Patent 0010052791, Feb 24, 1998.
29. M. Toshiitshi, et al., "Lead-free solder alloy," JP Patent 0009094688, Apr 8, 1997.
30. I. Toshihide, et al. "Solder, method for processing surface of printed wiring board, and method for mounting electronic part," EPO Patent 1213089A1, Jun 12, 2002.
31. K. Masayuki, et al. "Soldering method and soldered joint," EPO Patent 1196015A1, Feb 14, 2002.
32. T. Taguchi, et al., "Lead-free paste for reflow soldering," EPO Patent 1180411A1, Feb 20, 2002.
33. Y.Atsushi, et al., "Solder alloy of electrode for joining electronic parts and soldering method," EPO Patent 1084792A1, Apr 21, 2001.
34. Y.Atsushi, et al., "Solder alloy of electrode for joining electronic parts and soldering method," EPO Patent 1084791A1, Apr 21, 2001.
35. US Patent Act: 35 USCS, Part II, Chapter 10, Section 101.
36. US Patent Act: 35 USCS, Part II, Chapter 10, Section 102 (a).
37. US Patent Act: 35 USCS, Part II, Chapter 10, Section 103.
38. Syllabus of the United States Supreme Court: Festo Corp. v. Shoketsu Kinzoku Kogyo Kabushiki Co., Ltd., et al. No. 00-1543, decided May 28, 2002.
39. Syllabus of the United States Supreme Court: Warner Jenkinson Co., Inc., v. Hilton Davis Chemical Co. No. 95-728, decided Match 3, 1997.
40. Walter J. Blenko, "The Doctrine of Equivalents in Patent Infringement," Journal of Materials, vol. 42, May, 1990. p. 59.