Green packages-requirements, materials, results

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 1-5

  Dittes, M ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Composite materials; Electronics packaging; Environmentally friendly manufacturing techniques; Flame retardants; Lead compounds; Semiconductor device packaging; Semiconductor materials; Soldering; Temperature; Testing

Indexed keywords

CHIP SCALE PACKAGES; COMPOSITE MATERIALS; FLAME RETARDANTS; LEAD COMPOUNDS; LEAD-FREE SOLDERS; MATERIALS TESTING; MOLDS; PACKAGING MATERIALS; SEMICONDUCTOR DEVICE TESTING; SEMICONDUCTOR DEVICES; SEMICONDUCTOR MATERIALS; SOLDERING; SOLDERING ALLOYS; TEMPERATURE; TESTING;

HALOGENATED FLAME RETARDANT; LEAD FREE SOLDER BALLS; MANUFACTURING TECHNIQUES; MATERIALS AND PROCESS; PROCESS REQUIREMENTS; SEMICONDUCTOR COMPONENTS; SEMICONDUCTOR DEVICE PACKAGING; WETTING BEHAVIOUR;

ELECTRONICS PACKAGING;

EID: 0012129761     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906339     Document Type: Conference Paper

References (5)

1. IPC/JEDEC J-STD-020A Joint Industry Standard: Moisture/Reflow Sensitivity Classification fo Nonhermetic Solid State Surface Mount Devices, Arlington (VA) April 1999
2. National Center for Manufacturing Sciences, Lead-Free Solder Project Final Report: NCMS Report 0401RE96, August 1997
3. Jennie S. Hwang, Lead-free Solder: the Sn/Ag/Cu System. SMT 07/2000, pp. 18-21
4. Mulugeta Abtew, Guna Selvaduray: Lead-free Solders in Microelectronics. Materials Science and Engeneering, 27 (2000), pp. 95-141
5. NPL, ITRI, Lead-Free Soldering - An Analysis of the Current Status of Lead free Soldering, update 2000, dti Department of Trade and Industry, UK government