Fine-pitch wafer bumping and assembly for high density detector systems

IEEE Nuclear Science Symposium Conference Record

Volumn 5, Issue , 2003, Pages 3522-3526

  Huffman, Alan ^a   Labennett, Richard ^a   Bonafede, Salvatore ^a   Statler, Chad ^a  

^a MCNC   (United States)

Author keywords

Flip chip; Pixilated detectors

Indexed keywords

DETECTORS; ELECTRIC CONDUCTIVITY; ELECTROPLATING; IMAGING TECHNIQUES; RADIATION; TEMPERATURE MEASUREMENT;

DETECTOR ARRAYS; FLIP CHIP; PIXILATED DETECTORS; WAFER BUMPING;

HIGH ENERGY PHYSICS;

EID: 11944272343     PISSN: 10957863     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. S. Cihangir and S. Kwan; presentation from 3rd International Conference on Radiation Effects on Semiconductor Materials, Detectors and Devices. Florence, Italy (June. 28-30, 2000).
2. Cihangir, et al.: presentation from 7th Workshop on Electronics for LHC Experiments, Stockholm, Sweden (Sept. 10-14, 2001).
3. S. Kwan, et al.; "Study of Indium and Solder Bumps for the BTeV Pixel Detector," presented at the IEEE NSS-MIC 2003 Conference, Portland, OR, Oct. 19-25, 2003, paper N3-2.
4. Dr. Richard Lander, UC-Davis, private communication, 2001.