Processing, properties, and reliability of electroplated lead-free solder bumps

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 909-914

  Kiumi, R ^a   Yoshioka, J ^a   Kuriyama, F ^a   Saito, N ^a   Shimoyama, M ^a  

^a EBARA CORPORATION   (Japan)

Author keywords

Electroplating process; Lead free solder bump; Sn Ag eutectic alloy; Sn Ag Cu eutectic alloy; Sn Cu eutectic alloy

Indexed keywords

COMPOSITION; ELECTROPLATING; EUTECTICS; LEAD; LOW TEMPERATURE EFFECTS; MICROSTRUCTURE; TIN ALLOYS;

SOLDER BUMPS;

SOLDERING ALLOYS;

EID: 0036457590     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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