Reliability of lead-free solder interconnects - a review

Proceedings of the Annual Reliability and Maintainability Symposium

Volumn , Issue , 2002, Pages 423-428

  Tonapi, Sandeep ^a   Gopakumar, Sunil ^a   Borgesen, Peter ^a   Srihari, K ^a  

^a GE GLOBAL RESEARCH   (United States)

Author keywords

Flip chip; Lead free assembly; Lead free solder; Reflow; Reliability

Indexed keywords

ASSEMBLY; CMOS INTEGRATED CIRCUITS; COPPER; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; LEAD; PRINTED CIRCUIT TESTING; RELIABILITY; SILVER; SOLDERING; TIN;

LEAD FREE ASSEMBLY; METALLURGICAL EFFECTS; PRINTED CIRCUIT BOARD INTERCONNECTS; SOLDER JOINT PROPERTIES;

PRINTED CIRCUIT BOARDS;

EID: 0036130409     PISSN: 0149144X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. Flip chip on organic substrates
2. NEMI Pb-free interconnect task group report
3. Industry-based effort pushes for lead-free assemblies
4. An intermetalic study of solder joints with Sn-Ag-Cu lead-free solder
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6. Effects of Pb contamination on lead-free Sn/Ag/Bi solder, chip scale review
7. Pb-free solder alloys for flip chip applications
8. Assembly and solder joint reliability of plastic ball grid array with lead-free versus lead-tin interconnect
9. Lead-free - An overview of temperature cycling, aging, bend testing and plating chemical evaluation results
10. Reliability and au embrittlement of lead-free solders for BGA applications
11. Effect of flux and reflow parameters on lead-free chip assembly
12. Reliability studies of surface mount boards manufactured with lead-free solders
13. Transition to lead-free processes-issues and concerns
14. Growth of Cu-Ni-Sn alloys in Pb free CuSnAg solder/AuNi metallization reaction