Analysis of the tribological mechanisms arising in the chemical mechanical polishing of copper-film wafers when using a pad with concentric grooves

Journal of Tribology

Volumn 128, Issue 3, 2006, Pages 445-459

  Lin, Jen Fin ^a   Chen, Sheng Chao ^a   Ouyang, Yu Long ^a   Tsai, Ming Shih ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; LUBRICATION; METALLIC FILMS; SILICON WAFERS; TRIBOLOGY; WEAR OF MATERIALS;

CONCENTRIC GROOVES; COPPER-FILM WAFERS; PAD GROOVES; PRESSURE GRADIENTS; VOLUME FLOW RATE;

COPPER;

CHEMICAL MECHANICAL POLISHING; COPPER; LUBRICATION; METALLIC FILMS; SILICON WAFERS; TRIBOLOGY; WEAR OF MATERIALS;

EID: 33748472151     PISSN: 07424787     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2194913     Document Type: Article

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