Surface properties of film deposition using molecular dynamics simulation

Surface and Coatings Technology

Volumn 201, Issue 3-4, 2006, Pages 1796-1804

  Chu, Ching Jiung ^a   Chen, Tei Chen ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Deposition process parameters; Layer coverage; Molecular dynamics; Roughness; Substrate sizes

Indexed keywords

COMPUTER SIMULATION; DEPOSITION; FILM GROWTH; MOLECULAR DYNAMICS; MORPHOLOGY; SPUTTERING; SURFACE ROUGHNESS; TEMPERATURE;

DEPOSITION PROCESS PARAMETER; LAYER COVERAGE; SUBSTRATE SIZE;

SURFACE PROPERTIES;

COMPUTER SIMULATION; DEPOSITION; FILM GROWTH; MOLECULAR DYNAMICS; MORPHOLOGY; SPUTTERING; SURFACE PROPERTIES; SURFACE ROUGHNESS; TEMPERATURE;

EID: 33748437208     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2006.03.014     Document Type: Article

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