Low-stress ultra-thick SU-8 UV photolithography process for MEMS

Journal of Microlithography, Microfabrication and Microsystems

Volumn 4, Issue 4, 2005, Pages

  Li, Bo ^a   Liu, Miao ^a   Chen, Quanfang ^a  

^a University of Central Florida   (United States)

Author keywords

Adhesion; Low stress; Mechanical tensile testing; Post exposure bake; Process optimization; Thick SU 8

Indexed keywords

LOW STRESS; MECHANICAL TENSILE TESTING; POST-EXPOSURE BAKE; PROCESS OPTIMIZATION; THICK SU-8;

FABRICATION; FINITE ELEMENT METHOD; OPTICAL PROPERTIES; PHOTOLITHOGRAPHY;

MICROELECTROMECHANICAL DEVICES;

EID: 33747616171     PISSN: 15371646     EISSN: None     Source Type: Journal    
DOI: 10.1117/1.2117108     Document Type: Article

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