Fiber pigtailed multimode laser module based on passive device alignment on an LTCC substrate

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 3, 2006, Pages 463-472

  Keränen, Kimmo ^a   Mäkinen, Jukka Tapani ^a   Kautio, Kari T ^a   Ollila, Jyrki ^a   Petäjä, Jarno ^a   Heikkinen, Veli ^a   Heilala, Juhani ^a   Karioja, Pentti ^a  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

Hybrid integration; Low temperature cofired ceramics (LTCC); Passive alignment; Photonic module

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; GRADIENT INDEX OPTICS; HEAT LOSSES; OPTICAL FIBER COUPLING; SUBSTRATES;

HYBRID INTEGRATION; LOW-TEMPERATURE COFIRED CERAMICS; PASSIVE ALIGNMENT; PHOTONIC MODULE;

MULTIMODE FIBERS;

EID: 33747600137     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.872995     Document Type: Article

References (29)

1. T. Koch and U. Koren, "Semiconductor photonic integrated circuits," IEEE J. Quantum Electron., vol. 27, no. 3, pp. 641-653, Mar. 1991.
2. R. Soref, "Silicon based optoelectronics," Proc. IEEE, vol. 81, no. 12, pp. 1687-1706, Dec. 1993.
3. R. Kaiser, M. Hamacher, H. Heidrich, P. Albrecht, W. Ebert, R. Gibis, H. Kunzel, R. Löffler, S. Malchow, M. Möhrle, W. Rehbein, and H. Schroeter-Jansen, "Monolithically integrated transceivers on InP: The development nad generic integration concept and its technological challenges," in Proc. 10th Int. Conf. Indium Phosphide Related Mater., May 1998, pp. 431-434.
4. C. Armiento, M. Tabasky, C. Jagannath, T. Fitzgerald, C. Shieh, V. Barry, M. Rothmann, A. Negri, P. Haugsjaa, and H. Lockwood, "Passive coupling of InGaAsP/InP laser array and singlemode fibers using silicon waferrboard," Electron. Lett., vol. 27, pp. 1109-1110, Jun. 1991.
5. B. Corbett, K. Rodgers, F. Stain, D. O'Connell, P. Kelly, and G. Crean, "Low-stress hybridization of emitters, detectors and driver circuitry on a silicon motherboard for optoelectronic interconnect architecture," Mat. Sci. Semicond. Process., pp. 449-453, 2000.
6. S. Mino, K. Yoshmo, Y. Yamada, T. Terui, M. Yasu, and K. Moriwaki, "Planar lightwave circuit platform with coplanar waveguide for optoelectronic hybrid-integration," J. Lightw. Technol., vol. 13, no. 12, pp. 2320-2326, Dec. 1995.
7. T. Hashimoto, Y. Nakasuga, Y. Yamada, H. Terui, M. Yanagisawa, K. Moriwaki, Y. Susaki, Y. Tohmori, Y. Sakai, and H. Okamoto, "Hybrid-integration of spot-size converted laser diode on planar lightwave circuit platform by passive alignment technique," IEEE Photon. Technol. Lett., vol. 8, no. 11, pp. 1504-1506, Nov. 1996.
8. D. Vernooy, J. Paslaski, H. Blauvelt, R. Lee, and K. Vahala, "Alignment-insensitive coupling for PLC-based surface mount photonics," IEEE Photon. Technol. Lett., vol. 16, no. 1, pp. 269-271, Jan. 2004.
9. K. Kurata, "Mass production techniques for optical modules," in Proc. ECTC Conf., May 1998, pp. 572-580.
10. H. Althaus, W. Gramann, and K. Panzer, "Microsystems and wafer processes for volume production of highly reliable fiber-optic components for telecom- and datacom- application," IEEE Trans. Compon., Packag., Manuf. Technol. B, vol. 21, no. 2, pp. 147-156, May 1998.
11. E. Higurashi, R. Sawada, and T. Ito, "An integrated laser blood flowmeter," J. Lightw. Technol., vol. 21, no. 3, pp. 591-595, Mar. 2003.
12. W. Pittroff, G. Erbert, G. Beister, F. Bugge, A. Klein, A. Knauer, J. Maege, P. Ressel, J. Sebastian, R. Staske, and G. Traenkle, "Mounting of high power laser diodes on boron nitride heat sinks using optimized Au/Sn metallurgy," in Proc. ECTC Conf., May 2000, pp. 119-124.
13. W. Hunziker, W. Vogt, H. Melchior, P. Buchmann, and P. Vettiger, "Passive self-aligned low-cost packaging of semiconductor laser arrays on Si motherboard," IEEE Photon. Technol. Lett., vol. 7, no. 11, pp. 1324-1326, Nov. 1995.
14. J. Goodrich, "A silicon optical bench for approach to low-cost high speed tranceivers," in Proc. ECTC Conf., May-Jun. 2001, pp. 238-241.
15. Y. Sunaga, R. Takahashi, T. Tokoro, and M. Kobayashi, "2-Gbit/s small form factor fiber-optic transceiver for single mode optical fiber," IEEE Trans. Adv. Packag., vol. 23, no. 2, pp. 176-181, May 2000.
16. M. Uekawa, H. Sasaki, D. Shimura, K. Kotani, Y. Maeno, and T. Takamori, "Surface-mountable silicon microlens for low-cost laser modules," IEEE Photon. Technol. Lett., vol. 15, no. 7, pp. 945-947, Jul. 2003.
17. C. Malek and V. Saile, "Applications of LIGA technology to precision manufacturing of high-aspect-ratio micro-components and systems: A review," Microelectron. J., vol. 24, pp. 131-143, 2004.
18. A. Muller, J. Göttert, J. Mohr, and A. Rogner, "Fabrication of stepped microoptical benches for fiber and free space applications," Microsyst. Tech., vol. 2, pp. 40-45, 1996.
19. H. Schift and J. Söchtig, "LIGA-technology for the fabrication of positioned planar surfaces," Microsyst. Technol., vol. 4, pp. 132-134, 1998.
20. P. Karioja, J. Ollila, V.-P. Putila, K. Keränen, J. Häkkilä, and H. Kopola, "Comparison of active and passive fiber alignment techniques in laser pigtailing," in Proc. ECTC Conf., May 2000, pp. 244-249.
21. R. Keyssean, J. Sosnowski, M. Doyle, D. Amey, and S. Horowitz, "A new approach to opto-electronic/MEMS packaging," in Proc. ECTC Conf., May 2002, pp. 259-262.
22. U. Schmid, "A robust flow sensor for high-pressure automotive applications," Sens. Actuators A, vol. 97-98, pp. 253-263, 2002.
23. X. Gong, W. Chappell, and L. Katehi, "Multifunctional substrates for high-frequency applications," IEEE Microw. Wireless Compon. Lett., vol. 13, no. 10, pp. 428-430, Oct. 2003.
24. A. Sutono, A.-V. Pham, J. Laskar, and W. Smith, "RF/microwave characterization of multilayer ceramic-based MCM technology," IEEE Trans. Adv. Packag., vol. 22, no. 4, pp. 326-331, Aug. 1999.
25. C. Zhang, D. Liu, S. Mathews, J. Graves, T. Schaefer, B. Gilbert, R. Modi, H.D. Wu, and D. Chrisey, "Laser direct-write and its application in low-temperature cofired ceramic (LTCC) technology," Microelectron. Eng., vol. 70, pp. 41-49, 2003.
26. M. Gongora-Rubio, P. Espinoza-Vallejos, L. Sola-Laguna, and J. Santiago-Aviles, "Overview of low temperature cofired ceramics tape technology for meso-system technology (MsST)," Sens. Actuators A, vol. 89, pp. 222-241, 2001.
27. V. Chiriac and T.-J. Lee, "Thermal assessment of RF integrated LTCC front end module (FEM)," in Proc. Int. Soc. Conf. Thermal Phen., 2002, pp. 520-527.
28. K. Kautio, "Properties of high definition photoimaged conductors in LTCC," in Proc. IMAPS Nordic Conf., Sep.-Oct. 2002, pp. 227-232.
29. M. Karppinen, J.-T. Mäkinen, K. Kataja, A. Tanskanen, T. Alajoki, P. Karioja, M. Immonen, and J. Kivilahti, "Embedded optical interconnect on printed wiring board," Proc. SPIE, vol. 5453, pp. 150-164, Apr. 2004.