Embedded optical interconnect on printed wiring board

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5453, Issue , 2004, Pages 150-164

  Karppinen, Mikko ^a   Mäkinen, Jukka Tapani ^a   Kataja, Kari ^a   Tanskanen, Antti ^a   Alajoki, Teemu ^a   Karioja, Pentti ^a   Immonen, Marika ^b   Kivilahti, Jorma ^b  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^b AALTO UNIVERSITY   (Finland)

Author keywords

Alignment tolerance analysis; Micro optics; Optical interconnection; Optoelectronics packaging; Polymer waveguide; Printed wiring board

Indexed keywords

ELECTRONICS PACKAGING; MICROLENSES; MICROOPTICS; MONTE CARLO METHODS; OPTICAL INTERCONNECTS; OPTICAL WAVEGUIDES; RELIABILITY;

ALIGNMENT TOLERANCE ANALYSIS; OPTOELECTRONICS PACKAGING; POLYMER WAVEGUIDES; PRINTED WIRING BOARD (PWB);

PRINTED CIRCUIT BOARDS;

EID: 12344251981     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.545931     Document Type: Conference Paper

References (12)

1. D. Plant, and A. Kirk, "Optical Interconnects at the Chip and Board Level: Challenges and Solutions", Proceedings of IEEE, Vol. 88, No. 6, pp. 806-818 (June 2000).
2. E. Griese, "A High-Performance Hybrid Electrical-Optical Interconnection Technology for High-Speed Electronic Systems", IEEE Transactions on Advanced Packaging, Vol. 24, Number 3, pp. 375-383 (2001).
3. Y. Ishii, S. Koike, Y. Arai, and Y. Ando, "SMT-Compatible Large-Tolerance "OptoBump" Interface for Interchip Optical Interconnections", IEEE Transactions on Advanced Packaging, Vol. 26, No. 2, May 2003.
4. R. T. Chen, L. Lin, C. Choi, Y. J. Liu, B. Bihari, L. Wu, S. Tang, R. Wickman, B. Picor, M. K. Hibbs-Brenner, J. Bristow, and Y. S. Liu, "Fully Embedded Board-Level Guided-Wave Optoelectronic Interconnects", Proceedings of the IEEE, Vol. 88, No. 6, June 2000.
5. M. Immonen, M. Karppinen, J. Kivilahti, "Fabrication and characterization of optical polymer waveguides embedded on printed wiring boards", Proceedings of Polytronic 2003, 3rd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Montreux, Switzerland, 21-23 Oct. 2003, pp. 91-95 (2003).
6. M. Karppinen, K. Kautio, M. Heikkinen, J. Hakkila, P. Karioja, T. Jouhti, A. Tervonen, and M. Oksanen, "Passively aligned fiber-optic transmitter integrated into LTCC module", Proceedings of 51th Electronic Components and Technology Conference (ECTC), Florida, USA, May 29-June 1, 2001, pp. 20-25.
7. J.A. Hiltunen, K. Kautio, J.-T. Mäkinen, P. Karioja, and S. Kauppinen, "Passive Multimode Fiber-to-Edge-Emitting Laser Alignment Based on a Multilayer LTCC Substrate", Proceedings of 52th Electronic Components and Technology Conference (ECTC), San Diego, USA, May 28-31, 2002, pp. 815-820.
8. M. Karppinen, K. J. Kataja, J.-T. Mäkinen, S. Juuso, H. Rajaniemi, P. Pääkkönen, J. Turunen, J. Rantala, and P. Karioja, "Wireless infrared data links: Ray-trace simulations of diffuse channels and demonstration of diffractive element for multi-beam transmitters", Optical Engineering, vol. 41(4), pp. 899-910 (2002).
9. M. Karppinen, J.-T. Mäkinen, K. Kataja, A. Tanskanen, T. Alajoki, P. Karioja, M. Immonen, and J. Kivilahti, "Optical interconnect on printed wiring board", Photonics West, San Jose, USA, Jan 24-29 2004, Proc. of SPIE, vol. 5358, in print.
10. P. Mena et al., "A Simple Rate-Equation Based Thermal VCSEL Model", Journal of Lightwave Technology, vol. 17, no. 5, May 1999.
11. B. Thibeault et al., "High-speed characteristics of low optical loss oxide apertured vertical cavity lasers", IEEE Photonic Technology Letters, vol. 9, Jan. 1997.
12. Z. Toffano, "Multilevel behavioral simulation of VCSEL-based Optoelectronic modules", IEEE Journal of Selected Topics in Quantum Electronics, vol. 9, no. 3, May/June 2003.