A new approach for opto-electronic/MEMS packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 259-262

  Keusseyan, R ^a   Sosnowski, J ^a   Doyle, M ^a   Amey, D ^a   Horowitz, S ^a  

^a DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COAXIAL CABLES; FIBER OPTICS; GETTERS; METALLIZING; MICROELECTROMECHANICAL DEVICES; OPTOELECTRONIC DEVICES; THICK FILM CIRCUITS; VACUUM;

MICRO-ELECTRO MECHANICAL SYSTEMS (MEMS) PACKAGING;

ELECTRONICS PACKAGING;

EID: 0036292811     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)

1. Packaging of high speed digital electronic circuits
2. Electronic packaging interconnection technology: State of the art and future developments
3. Thick film hybrids