Atomic force microscopy (AFM) and X-ray diffraction (XRD) investigations of copper thin films prepared by dc magnetron sputtering technique

Microelectronics Journal

Volumn 37, Issue 10, 2006, Pages 1064-1071

  Chan, Kah Yoong ^a   Teo, Bee San ^a  

^a MULTIMEDIA UNIVERSITY   (Malaysia)

Author keywords

Copper; Deposition pressure; Microstructure; Morphology; Sputtering power

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; MAGNETRON SPUTTERING; MICROSTRUCTURE; SILICON; X RAY DIFFRACTION ANALYSIS;

COPPER THIN FILMS; DEPOSITION PRESSURE; SPUTTERING POWER;

THIN FILMS;

EID: 33746830458     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2006.04.008     Document Type: Article

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