Thickness dependence of the structural and electrical properties of copper films deposited by dc magnetron sputtering technique

Microelectronics Journal

Volumn 37, Issue 7, 2006, Pages 608-612

  Chan, Kah Yoong ^a   Tou, Teck Yong ^a   Teo, Bee San ^a  

^a MULTIMEDIA UNIVERSITY   (Malaysia)

Author keywords

Copper; Electrical properties; Film thickness; Sputtering; Structural properties

Indexed keywords

ARGON; ATOMIC FORCE MICROSCOPY; COPPER; ELECTRIC PROPERTIES; GRAIN SIZE AND SHAPE; MAGNETRON SPUTTERING; MICROSTRUCTURE; SILICON; X RAY DIFFRACTION;

FILM THICKNESS; GAS PRESSURE; MICROSTRUCTURE FORMATION; STRUCTURAL PROPERTIES;

THIN FILMS;

EID: 33646263833     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:20060812     Document Type: Article

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