Integrating dynamic thermal via planning with 3D floorplanning algorithm

Proceedings of the International Symposium on Physical Design

Volumn 2006, Issue , 2006, Pages 178-185

  Li, Zhuoyuan ^a   Hong, Xianlong ^a   Zhou, Qiang ^a   Zeng, Shan ^a   Bian, Jinian ^a   Yang, Hannah ^b   Pitchumani, Vijay ^c   Cheng, Chung Kuan ^c  

^a TSINGHUA UNIVERSITY   (China)

^b INTEL CORPORATION   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

3D Floorplanning; Thermal Optimization; Thermal Via

Indexed keywords

ALGORITHMS; COMPUTATIONAL COMPLEXITY; OPTIMIZATION; PROBLEM SOLVING; STRATEGIC PLANNING;

3D FLOORPLANNING; THERMAL OPTIMIZATION; THERMAL VIA;

INTEGRATED CIRCUIT LAYOUT;

EID: 33745958184     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1123008.1123048     Document Type: Conference Paper

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