Driving mechanisms of delamination related reliability problems in exposed pad packages

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 183-189

  Van Driel, W D ^a   Bressers, H J L ^a   Janssen, J H J ^a   Bielen, J A ^a   Yan, X ^a   Van Gils, M A J ^b   Stevens, P M P ^b   Habets, P J J H A ^c   Zhang, G Q ^b,c   Ernst, L J ^d  

^a NXP SEMICONDUCTORS   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

^d DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BEARING PADS; PROBLEM SOLVING; STITCHING (METAL JOINING); THERMAL EFFECTS;

DIE THICKNESS; FE MODELING; J VALUE; PAD PACKAGES;

ELECTRONICS PACKAGING;

EID: 33745698146     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502797     Document Type: Conference Paper

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