Adhesion measurement for electronic packaging applications using double cantilever beam method

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 1, 2000, Pages 101-116

  Dai, Xiang ^a   Brillhart, Mark V ^b   Ho, Paul S ^c  

^a HEWLETT PACKARD COMPANY   (United States)

^b CISCO SYSTEMS   (United States)

^c UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); DELAMINATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FRACTURE TESTING; INTEGRATED CIRCUIT TESTING; INTERFACES (MATERIALS); MATHEMATICAL MODELS; MICROELECTRONICS; RESIDUAL STRESSES; THERMAL STRESS;

DOUBLE CANTILEVER BEAM METHOD;

ELECTRONICS PACKAGING;

EID: 0033877492     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.833049     Document Type: Article

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