Processing-adhesion relations for die attach adhesives and underfill resins

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998

Volumn 1998-September, Issue , 1998, Pages 160-167

  Taweeplengsangsuke, J ^a   Pearson, R A ^a  

^a LEHIGH UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVES; BOND STRENGTH (MATERIALS); CHIP SCALE PACKAGES; COATINGS; CURING; FAILURE (MECHANICAL); FLIP CHIP DEVICES; ISOTHERMS; JOINING; PASSIVATION; RESINS;

ADHESIVE BOND STRENGTHS; FLIP CHIP TECHNOLOGIES; FLOW CHARAC-TERISTICS; INTERFACIAL FAILURES; ISOTHERMAL CONDITIONS; NUMBER OF CYCLES TO FAILURE; PACKAGING TECHNOLOGIES; PROCESSING CONDITION;

DIES;

EID: 33645591996     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.1998.742021     Document Type: Conference Paper

References (11)

1. J. H. Hsiung, and R. A. Pearson, Proc. Of 47th ECTC Conference, 536 (1997).
2. J. Ft. Hsiung, PhD Thesis, Lehigh University, PA, U.S.A., 1998
3. A.F.J. Baggerman, J.F.J.M. Caers, J.J. Wondergen, and A.G. Wagemans, IEEE Trans. Comp. Pakaging Manuf. Technol. B19, 736 (1996).
4. G. Lehmann, A. Maria, Pin-Chou Lee, and E. J. Cotts, Proc. Of The Technical Program, 1, 340(1996).
5. T. E. Driscoll, P.C. Li, G. L. Lehmann, and EW. J. Cotts, Mat. Res. Soc. Symp. Proc, 445, 69 (1997).
6. A. R. Plepys, and R. J. Faris, Polymer, 31, 1932(1990).
7. G. Liu, and A. N. Gent, J.Adhesion, 38, 79 (1992).
8. L. G. Feinstien, "Electronic Materials Handbook", ASM International, Vol. 1, Ohio, P.213, 1989.
9. D. R. Edwards et al, Proc Of 37th Conference, 48 (1987).
10. K. Sumita, K. Kumagae, K. Dobashi, T. Shiogara, M. Kuroda, Mater. Res. Soc. Symp. Proc, 445 (Electronic Packaging Materials Science IX), 1997, pp. 69-74.
11. B. Blackman, J. P. Dear, A. J. Kinloch, and S. Osiyemi, J. Mat. Sci. Lett., 10, 253 (1991).