Response surface modeling for nonlinear packaging stresses

Journal of Electronic Packaging

Volumn 125, Issue 4, 2003, Pages 490-497

  Van Driel, W D ^a   Zhang, G Q ^b   Janssen, J H J ^a   Ernst, L J ^c  

^a NXP SEMICONDUCTORS   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; FAILURE ANALYSIS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; OPTIMIZATION; PROCESS ENGINEERING; PRODUCT DESIGN; RELIABILITY; STRESSES;

FAILURE MODELS; PROCESS DESIGNS; THERMO MECHANICAL SIMULATION MODELS; VERTICAL DIE CRACKS;

ELECTRONICS PACKAGING;

EID: 0348197116     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1604149     Document Type: Article

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