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Volumn 44, Issue 9-11 SPEC. ISS., 2004, Pages 1317-1322

Characterization and modelling of moisture driven interface failures

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MOISTURE; STANDARDS; THERMOMECHANICAL TREATMENT;

EID: 4544322746     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.07.019     Document Type: Conference Paper
Times cited : (30)

References (14)
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  • 2
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  • 3
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    • The impact of moisture diffusion during solder reflow on package reliability
    • Tay A.A.O., Lin T.Y. The Impact of Moisture Diffusion During Solder Reflow on Package Reliability. Proc. ECTC 1999, pp. 830-836.
    • Proc. ECTC 1999 , pp. 830-836
    • Tay, A.A.O.1    Lin, T.Y.2
  • 4
    • 0346519657 scopus 로고    scopus 로고
    • Modelling of interfacial delamination in plastic IC packages under hygrothermal loading
    • Tay A.A.O. Modelling of Interfacial Delamination in Plastic IC Packages Under Hygrothermal Loading. Proc. EuroSiME 2002, pp. 195-206.
    • Proc. EuroSiME 2002 , pp. 195-206
    • Tay, A.A.O.1
  • 5
    • 3843078834 scopus 로고    scopus 로고
    • Studies on moisture diffusion and popcorn cracking
    • Dudek R. Studies on Moisture Diffusion and Popcorn Cracking. Proc. EuroSimE2002,pp. 225-232.
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    • Dudek, R.1
  • 6
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    • Whole field vapour pressure modelling of QFN during reflow with coupled hygro-mechanical and thermo-mechanical stresses
    • Tee T.Y., Ng H.S. Whole Field Vapour Pressure Modelling of QFN during Reflow with Coupled Hygro-mechanical and Thermo-mechanical Stresses. Proc. ECTC 2002, pp. 1552-1559.
    • Proc. ECTC 2002 , pp. 1552-1559
    • Tee, T.Y.1    Ng, H.S.2
  • 7
    • 0031234029 scopus 로고    scopus 로고
    • Moisture absorption and desorption predictions for plastic ball grid array packages
    • Galloway J.E., Miles M.M. Moisture Absorption and Desorption Predictions for Plastic Ball Grid Array Packages. IEEE Trans-CPMT-A, Vol. 20, No. 3 (1997), pp. 274-279.
    • (1997) IEEE Trans-CPMT-A , vol.20 , Issue.3 , pp. 274-279
    • Galloway, J.E.1    Miles, M.M.2
  • 8
    • 0037988809 scopus 로고    scopus 로고
    • Prediction and verification of process induced warpage of electronic packages
    • Driel W.D. van, Zhang G.Q., Janssen J.H.J. Prediction and Verification of Process Induced Warpage of Electronic Packages. Microelectronics Reliability, 43 (5), 2003, pp. 765-774.
    • (2003) Microelectronics Reliability , vol.43 , Issue.5 , pp. 765-774
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  • 9
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    • Analytical solution for moisture-induced interface delamination in electronic packaging
    • Fan X.J., Zhang G.Q., Driel W.D. van. Analytical Solution for Moisture-Induced Interface Delamination in Electronic Packaging. Proc. ECTC2003, pp. 733-738.
    • Proc. ECTC2003 , pp. 733-738
    • Fan, X.J.1    Zhang, G.Q.2    Van Driel, W.D.3
  • 10
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    • Moisture-induced failures in flip chip PBGA. Electronic packaging research consortium 1999
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    • Fan X.J., Yang Z.V. Moisture-Induced Failures in Flip Chip PBGA. Electronic Packaging Research Consortium 1999, IME Singapore, Final report, Project 3, January 2000.
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    • Fan, X.J.1    Yang, Z.V.2
  • 11
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    • Virtual qualification of moisture induced failures of advanced packages
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  • 12
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  • 13
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