Creep and crack propagation in flip chip SnPb37 solder joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 1015-1020

  Wiese, S ^a   Feustel, F ^a   Rzepka, S ^a   Meusel, E ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACK INITIATION; CRACK PROPAGATION; CREEP; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FRACTURE; FRACTURE MECHANICS; SOLDERED JOINTS; STIFFNESS; STRAIN RATE; STRESS ANALYSIS;

CREEP EQUATION; DEFORMATION MECHANISM; FINITE STIFFNESS; FLIP CHIP PACKAGES; FLIP CHIP SOLDERED JOINT; MICROSHEAR TESTERS;

FLIP CHIP DEVICES;

EID: 0032642986     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)