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Volumn 2005, Issue , 2005, Pages 61-64

Low-loss contact pad with tuned impedance for operation at millimeter wave frequencies

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC IMPEDANCE; ELECTRIC LINES; RESONANCE; SILICON; SUBSTRATES;

EID: 33745499778     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SPI.2005.1500898     Document Type: Conference Paper
Times cited : (10)

References (11)
  • 3
    • 0141595168 scopus 로고    scopus 로고
    • High-isolation bonding pad design for silicon RFIC up to 20 GHz
    • Sept.
    • S. Lam, P.K.T. Mok, P.K. Ko, and C. Mansun, "High-isolation bonding pad design for silicon RFIC up to 20 GHz," IEEE Electron Device Letters, vol. 24, no. 9, pp. 601-603, Sept. 2003.
    • (2003) IEEE Electron Device Letters , vol.24 , Issue.9 , pp. 601-603
    • Lam, S.1    Mok, P.K.T.2    Ko, P.K.3    Mansun, C.4
  • 5
    • 0000133648 scopus 로고    scopus 로고
    • Effects of substrate resistances on LNA performance and a bondpad structure for reducing the effects in a silicon bipolar technology
    • Sept.
    • J.T. Colvin, S.S. Bhatia, and K.K. O, "Effects of substrate resistances on LNA performance and a bondpad structure for reducing the effects in a silicon bipolar technology," IEEE Journal of Solid-State Circuits, vol. 34, no. 9, pp. 1339-1344, Sept. 1999.
    • (1999) IEEE Journal of Solid-state Circuits , vol.34 , Issue.9 , pp. 1339-1344
    • Colvin, J.T.1    Bhatia, S.S.2    O, K.K.3
  • 6
    • 0037250309 scopus 로고    scopus 로고
    • Simple noise deembed-ding technique for on-wafer shield-based test fixtures
    • Jan.
    • T.E. Kolding and C.R. Iversen, "Simple noise deembed-ding technique for on-wafer shield-based test fixtures," IEEE Transactions on Microwave Theory and Techniques, vol.51,no. 1, pp. 11-15, Jan. 2003.
    • (2003) IEEE Transactions on Microwave Theory and Techniques , vol.51 , Issue.1 , pp. 11-15
    • Kolding, T.E.1    Iversen, C.R.2
  • 7
    • 0034499917 scopus 로고    scopus 로고
    • Gate layout and bonding pad structure of a rf n-mosfet for low noise performance
    • Dec.
    • Cheon Soo Kim, Jung-Woo Park, Hyun Kyu Yu, and H. Cho, "Gate layout and bonding pad structure of a rf n-mosfet for low noise performance," IEEE Electron Device Letters, vol. 21, no. 12, pp. 607-609, Dec. 2000.
    • (2000) IEEE Electron Device Letters , vol.21 , Issue.12 , pp. 607-609
    • Kim, C.S.1    Park, J.-W.2    Yu, H.K.3    Cho, H.4
  • 8
    • 0035369527 scopus 로고    scopus 로고
    • Shield-based microwave on-wafer device measurements
    • June
    • T.E. Kolding, "Shield-based microwave on-wafer device measurements," IEEE Transactions on Microwave Theory and Techniques, vol. 49, no. 6, pp. 1039-1044, June 2001.
    • (2001) IEEE Transactions on Microwave Theory and Techniques , vol.49 , Issue.6 , pp. 1039-1044
    • Kolding, T.E.1
  • 11
    • 0018720739 scopus 로고
    • Thru-reftect-line: An improved technique for calibrating the dual six-port automatic network analyzer
    • Dec.
    • Glenn F. Engen and Cletus A. Hoer, "Thru-reftect-line: An improved technique for calibrating the dual six-port automatic network analyzer," IEEE Transactions on Microwave Theory and Techniques, vol. 27, no. 12, pp. 987-993, Dec. 1979.
    • (1979) IEEE Transactions on Microwave Theory and Techniques , vol.27 , Issue.12 , pp. 987-993
    • Engen, G.F.1    Hoer, C.A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.