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Volumn 21, Issue 12, 2000, Pages 607-609

Gate layout and bonding pad structure of a RF n-MOSFET for low noise performance

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); CMOS INTEGRATED CIRCUITS; ELECTRIC GROUNDING; ELECTRIC RESISTANCE; GATES (TRANSISTOR); TECHNOLOGY TRANSFER;

EID: 0034499917     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/55.887481     Document Type: Article
Times cited : (44)

References (11)
  • 1
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    • (1999) Svmp. VLSI Technology Dig. Tech. Papers , pp. 163-164
    • Morifuji, E.1
  • 2
    • 0022150296 scopus 로고
    • Distributed substrate resistance noise in fine-line NMOS field-effect transistors
    • Nov.
    • R. P. Jindal, "Distributed substrate resistance noise in fine-line NMOS field-effect transistors," IEEE Trans. Electron Devices, vol. ED-32, pp. 2450-2453, Nov. 1985.
    • (1985) IEEE Trans. Electron Devices , vol.ED-32 , pp. 2450-2453
    • Jindal, R.P.1
  • 3
    • 0029545625 scopus 로고
    • An assessment of the state-of-the-art 0.5 μm bulk CMOS technology for RF applications
    • S. P. Voinigescu, S. W. Tarasewicz, T. MacElwee, and J. Ilowski, "An assessment of the state-of-the-art 0.5 μm bulk CMOS technology for RF applications," in IEDM Tech. Dig., 1995, pp. 721-724.
    • (1995) IEDM Tech. Dig. , pp. 721-724
    • Voinigescu, S.P.1    Tarasewicz, S.W.2    MacElwee, T.3    Ilowski, J.4
  • 4
    • 0030648274 scopus 로고    scopus 로고
    • CMOS layout and bias optimization for RF IC design applications
    • C. S. Kim et al., "CMOS layout and bias optimization for RF IC design applications," in IEEE MTT-s Microwave Symp. Dig., 1997, pp. 945-948.
    • (1997) IEEE MTT-s Microwave Symp. Dig. , pp. 945-948
    • Kim, C.S.1
  • 5
    • 0033327910 scopus 로고    scopus 로고
    • Thick metal CMOS technology on high resistivity substrate and its application to monolithic L-band CMOS LNAs
    • Dec.
    • C. S. Kim et al., "Thick metal CMOS technology on high resistivity substrate and its application to monolithic L-band CMOS LNAs," ETRI J., vol. 21, pp. 1-8, Dec. 1999.
    • (1999) ETRI J. , vol.21 , pp. 1-8
    • Kim, C.S.1
  • 7
    • 0032307874 scopus 로고    scopus 로고
    • A bind-pad structure for reducing effects of substrate resistance on LNA performance in a silicon bipolar technology
    • Sept.
    • J. C. Colvin, S. S. Bhatia, and K. K. O, "A bind-pad structure for reducing effects of substrate resistance on LNA performance in a silicon bipolar technology," in Proc. BCTM, Sept. 1998, pp. 109-112.
    • (1998) Proc. BCTM , pp. 109-112
    • Colvin, J.C.1    Bhatia, S.S.2    O, K.K.3
  • 8
    • 0027990097 scopus 로고
    • Bonding pad models for silicon VLSI technologies and their effects on the noise figure of RF NPN's
    • San Diego, CA
    • N. Camilleri et al., "Bonding pad models for silicon VLSI technologies and their effects on the noise figure of RF NPN's," in Proc. Microwave & Millimeter-Wave Monolithic Circuits Symp., San Diego, CA, 1994, pp. 225-228.
    • (1994) Proc. Microwave & Millimeter-wave Monolithic Circuits Symp. , pp. 225-228
    • Camilleri, N.1
  • 9
    • 85081431465 scopus 로고    scopus 로고
    • Submicron CMOS thermal modeling from an RF perspective
    • J. Ou, X. Jin, C. Hu, and P. Gray, "Submicron CMOS thermal modeling from an RF perspective," in VLSI Technology Symp., 1999, pp. 721-724.
    • (1999) VLSI Technology Symp. , pp. 721-724
    • Ou, J.1    Jin, X.2    Hu, C.3    Gray, P.4
  • 10
    • 0032277985 scopus 로고    scopus 로고
    • An effective gate resistance model for CMOS RF and noise modeling
    • X. Jin et al., "An effective gate resistance model for CMOS RF and noise modeling," in IEDM Tech. Dig., 1998, pp. 961-964.
    • (1998) IEDM Tech. Dig. , pp. 961-964
    • Jin, X.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.