Contact-pad design for high-frequency silicon measurements

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2000, Pages 131-134

  Williams, Dylan F ^a   Byers, Andrew C ^a   Tyree, Vance C ^a   Walker, David K ^a   Ou, Jeffrey J ^a   Jin, Xiaodong ^a   Piket May, Melinda ^a   Hu, Chenming ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; ELECTRIC CONTACTS; SILICON WAFERS;

CONTACT PADS; ELECTRICAL PARASITICS;

INTEGRATED CIRCUIT LAYOUT;

EID: 0034510031     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (2)