Shield-based microwave on-wafer device measurements

IEEE Transactions on Microwave Theory and Techniques

Volumn 49, Issue 6 I, 2001, Pages 1039-1044

  Kolding, Troels Emil ^a,b  

^a IEEE   (Denmark)

^b AALBORG UNIVERSITY   (Denmark)

Author keywords

Analog integrated circuits; Calibration; Microwave measurements

Indexed keywords

ANALOG INTEGRATED CIRCUITS;

COST EFFECTIVENESS; ELECTRIC IMPEDANCE; ELECTROMAGNETIC SHIELDING; INTEGRATED CIRCUITS; LEAKAGE CURRENTS; MOSFET DEVICES; SILICON WAFERS; SUBSTRATES;

MICROWAVE MEASUREMENT;

EID: 0035369527     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.925488     Document Type: Article

References (18)

1. M. C. A. M. Koolen, J. A. M. Geelen, and M. P. J. G. Versleijen, "An improved de-embedding technique for on-wafer high-frequency characterization," in Proc. IEEE Bipolar Circuits Technol. Meeting, Minneapolis, MN, Sept. 1991, pp. 188-191.
2. H. Cho and D. E. Burk, "A three-step method for the de-embedding of high-frequency S-parameter measurements," IEEE Trans. Electron Devices, vol. 38, pp. 1371-1375, June 1991.
3. J. Weng, "Error correction in high-frequency on-wafer measurements," in Proc. IEEE Int. Microelectron. Test Structures Conf., San Diego, CA, Mar. 1994, pp. 164-167.
4. J.-L. Carbonéro, G. Morin, and B. Cabon, "Comparison between beryllium- copper and tungsten high frequency air coplanar probes," IEEE Trans. Microwave Theory Tech., vol. 43, pp. 2786-2793, Dec. 1995.
5. T. E. Kolding, "General accuracy considerations of microwave on-wafer silicon device measurements," in IEEE MTT-S Int. Microwave Symp. Dig., vol. 3, Boston, MA, June 2000, pp. 1839-1842.
6. J.-P. Raskin, R. Gillon, J. Chen, D. Vanhoenacker-Janvier, and J.-P. Colinge, "Accurate SOI MOSFET characterization at microwave frequencies for device performance optimization and analog modeling," IEEE Trans. Electron Devices, vol. 45, pp. 1017-1025, May 1998.
7. T. E. Kolding, "On-wafer calibration techniques for gigahertz CMOS measurements," in Proc. IEEE Int. Microelectron. Test Structures Conf., Göteborg, Sweden, Mar. 1999, pp. 105-110.
8. R. Gillon,W.V. D. Sype, D.Vanhoenacker, and L. Martens, "Comparing high-frequency de-embedding strategies: Immitance correction and in situ calibration," in Proc. IEEE Int. Microelectron. Test Structures Conf., Monterey, CA, Mar. 2000, pp. 241-245.
9. R. Gillon, "Modeling and characterization of the SOI MOSFET for MMIC applications," Ph.D. dissertation, Lab. D'Hyperfréquences, Univ. Catholique de Louvain, Louvain-la-Neuve, Belgium, 1998.
10. T. E. Kolding, "A four-step method for de-embedding gigahertz on-wafer CMOS measurements," IEEE Trans. Electron Devices, vol. 47, pp. 734-740, Apr. 2000.
11. - "On-wafer measuring techniques for characterizing RFCMOSdevices," Ph.D. dissertation, RISC Group, Aalborg Univ., Aalborg, Denmark, 1999.
12. T. E. Kolding, O. K. Jensen, and T. Larsen, "Ground-shielded measuring technique for accurate on-wafer characterization of RF CMOS devices," in Proc. IEEE Int. Microelectron. Test Structures Conf., Monterey, CA, Mar. 2000, pp. 106-111.
13. A. Rofougaran, J. Y.-C. Chang, M. Rofougaran, and A. A. Abidi, "A 1-GHzCMOSRF front-end IC for a direct conversion wireless receiver," IEEE J. Solid-State Cirucits, vol. 31, pp. 880-889, July 1996.
14. J. T. Colvin, S. S. Bhatia, and K. K. O, "A bond-pad structure for reducing effects of substrate resistance on LNA performance in a silicon bipolar technology," in Proc. IEEE Bipolar Circuits Technol. Meeting, Minneapolis, MN, Sept. 1998, pp. 109-112.
15. "Layout rules for GHz-probing," Cascade Microtech Inc., Beaverton, OR, Applicat. Note LAYOUT19, 1989.
16. T. E. Kolding, "Impact of test-fixture forward coupling on on-wafer silicon device measurements," IEEE Trans. Microwave Guided Wave Lett., vol. 10, pp. 73-74, Feb. 2000.
17. C.-H. Kim, C. S. Kim, H. K. Yu, and K. S. Nam, "An isolated-open pattern to de-embed pad parasitics," IEEE Microwave Guided Wave Lett., vol. 8, pp. 96-98, Feb. 1998.
18. H. Hillbrand and P. H. Russer, "An efficient method for computer aided noise analysis of linear amplifier networks," IEEE Trans. Circuits Syst., vol. CAS-23, pp. 235-238, Apr. 1976.