Electroplating of low stress permalloy for MEMS

Materials Characterization

Volumn 57, Issue 2, 2006, Pages 121-126

  Zhang, Yong hua ^a   Ding, Gui fu ^a   Cai, Yu li ^a   Wang, Hong ^a   Cai, Bingchu ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Electroplating; Laminated cantilever beam; MEMS; Permalloy; Stress; Wafer bending method

Indexed keywords

CANTILEVER BEAMS; ELECTROPLATING; LAMINATED COMPOSITES; MAGNETOELECTRIC EFFECTS; MICROELECTROMECHANICAL DEVICES; SPECTROPHOTOMETRY; STRESS ANALYSIS;

BATH CONCENTRATION; LAMINATED CANTILEVER BEAM; MEMS; PERMALLOYS; WAFER-BENDING METHOD;

ALLOYING ELEMENTS;

EID: 33745272983     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2005.12.016     Document Type: Article

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