Component rework: A small world and getting smaller

Circuits Assembly

Volumn 14, Issue 1, 2003, Pages 32-37

  Walz, Mark J ^a  

^a Training and Tooling Associates Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER SOFTWARE; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICE MANUFACTURE; THERMOCOUPLES;

MICRO SURFACE MOUNT DEVICES;

SURFACE MOUNT TECHNOLOGY;

EID: 0037246342     PISSN: 10540407     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (6)

1. Naugler D., "Summit 1100/1100HR Placement Capability," 1999, SRT Publication.
2. D. Naugler, "Thermal Process Development for Rework Using Auto Profile Software," Proceedings of NEPCON West 2000, Anaheim, CA, Volume 1, p. 20-29, February 2000.
3. Kapton® is a high temperature polyimide film tape and is a registered trademark of the DuPont Company.
4. Omega type SA-1-SC with self-adhesive removed.
5. This technique was correlated in prior work by comparing the thermocouple responses of a 5-mil TC epoxied in a hole drilled in the board beneath a μSMD and comparing the TC response to the .0005" foil TC taped to a bare site beneath differing layers of Kapton tape.
6. Parvez M.S. Patel and K. Srihari, PhD., "Process Overview-Rework of Chip Scale Packages," Department of System Science and Industrial Engineering, State University of New York, December 1998.