Role of amine and carboxyl functional groups of complexing agents in slurries for chemical mechanical polishing of copper

Journal of the Electrochemical Society

Volumn 152, Issue 12, 2005, Pages

  Gorantla, Venkata R K ^a,c   Goia, Dan ^a   Matljević, Egon ^a   Babu, S V ^a,b  

^a CLARKSON UNIVERSITY   (United States)

^b ELECTROCHEMICAL SOCIETY

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBOXYL FUNCTIONAL GROUPS; COMPLEXING AGENTS;

ACETIC ACID; CHEMICAL MECHANICAL POLISHING; COPPER; DISSOLUTION; PH EFFECTS; SLURRIES; SOLUTIONS;

AMINES;

EID: 30344439560     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2083287     Document Type: Article

References (26)

1. M. A. Martinez, Solid State Technol., 37(5), 26 (1994).
2. J. M. Steigerwald, S. P. Murarka, and R. J. Gutmann, Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, New York (1996);
3. P. B. Zantye, A. Kumar, and A. K. Sikdar, Mater. Sci. Eng., R., 45, 89 (2004).
4. C. L. Borst, W. N. Gill, and R. J. Gutmann, Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mecha nisms and Application to IC Interconnect Technology, Kluwer Academic Publishers, Norwell, MA (2002).
5. P. Wrschka, J. Hernandez, G. S. Oehrlein, and J. King, J. Electrochem. Soc., 147, 706 (2000).
6. R. Caprio, J. Farkas, and R. Jairath, Thin Solid Films, 266, 238 (1995).
7. . Chemical-Mechanical Polishing 2000: Fundamentals and Material Issues, R. K. Singh, R. Bajaj, M. Moinpour, and M. Meuris, Editors, Vol. 613, Materials Research Society Symposium Proceedings, Warrendale, PA (2000).
8. Chemical-Mechanical Polishing-Advances and Future Challenges, S. V. Babu, K. C. Cadien, and H. Yano, Editors, Vol. 671, Materials Research Society Symposium Proceedings, Warrendale, PA (2001).
9. Chemical-Mechanical Planarizatlon, S. V. Babu, R. K. Singh, N. Hayasaka, and M. Oliver, Editors, Vol. 732E, Material Research Society Symposium Proceedings, Warrendale, PA (2002).
10. . D. Zeidler, Z. Stavreva, M. Plotner, and K. Drescher, Microelectron. Eng., 33, 259 (1997).
11. M. Fayolle and F. Romagna, Microelectron. Eng., 37/38, 135 (1997).
12. T. Du, D. Tamboli, V. Desai, and S. Seal, J. Electrochem. Soc., 151, 0230 (2004).
13. Q. Luo, D. R. Campbell, and S. V. Babu, Chem. Mater., 9, 2101 (1997).
14. P. Wrschka, J. Hernandez, G. S. Oehrlsin, J. A. Negrych, G. Haag, P. Rau, and J. E. Currie, J. Electrochem. Soc., 148, G321 (2001).
15. J. Hernandez, P. Wrschka, and G. S. Oehrlein, J. Electrochem. Soc., 148, G389 (2001).
16. S. Kondo, N. Sakuma, Y. Homma, and N. Ohashi, in Electrochemical Processing in ULSI Fabrication I-and-Interconnect and Contact Metallization: Materials, Processes and Reliability, P. C. Andricacos, J. O. Dukovic, G. S. Mathad, G. M. Oleszek, H. S. Rathore, and C. Reidsema-Simpson, Editors, PV 98-6, pp. 195-205, The Electrochemical Society Proceedings Series, Pennington, NJ (1998);
17. V. R. K. Gorantla, K. A. Assiongbon, S. V. Babu, and D. Roy, J. Electrochem. Soc., 152, 0404 (2005).
18. H. Hirabayashi, M. Higuchi, M. Kinoshita, H. Kaneko, N. Hayasaka, K. Mase, and J. Oshima, in Proceedings of the 1st International CMP for VLSI/ULSI Multilevel Interconnection Conference, Santa Clara, CA, p. 119 (1996).
19. V. R. K. Gorantla, A. Babel, S. Pandija, and S. V. Babu, Electrochem. Solid-Slate Lett., 8, 0131 (2005).
20. J. Lu, J. E. Garland, C. M. Pettit, S. V. Babu, and D. Roy, J. Electrochem. Soc., 151, G717 (2004).
21. S. Seal, S. C. Kuiry, and B. Heinmen, Thin Solid Films, 423, 243 (2003).
22. Z. Crnjak-Orel, E. Matijevic, and D. V. Goia, J. Mater. Res., 18, 1017 (2003).
23. J. Weiss, Adv. Catal., 4, 343 (1952).
24. K. A. Assiongbon, S. B. Emery, C. M. Pettit, S. V. Babu, and D. Roy, Mater. Chem. Phys., 86, 347 (2004).
25. A. Jindal and S. V. Babu, J. Electrochem. Soc., 151, G709 (2004).
26. J. R. LaGraff and A. A. Gewinn, Surf. Sci., 326, L461 (1995).