Integration challenges for CMP of copper

MRS Bulletin

Volumn 27, Issue 10, 2002, Pages

  Bajaj, Rajeev ^a   Zutshi, Ajoy ^a   Surana, Rahul ^a   Naik, Mehul ^a   Pan, Tony ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

Chemical mechanical planarization; Chemical mechanical polishing; CMP; Copper; Electroplating; Integration; Low k dielectric films

Indexed keywords

COPPER; DIELECTRIC MATERIALS; ELECTROPLATING; ETCHING; MICROELECTRONICS; SILICA; WIRE;

DAMASCENE PROCESSING;

CHEMICAL MECHANICAL POLISHING;

EID: 0036802779     PISSN: 08837694     EISSN: None     Source Type: Journal    
DOI: 10.1557/mrs2002.249     Document Type: Article

References (8)

1. R.K. Singh, R. Bajaj, M. Moinpour, and M. Meuris, eds., Chemical-Mechanical Polishing 2000 - Fundamentals and Materials Issues (Mater. Res. Soc. Symp. Proc. 613, Warrendale, PA, 2000).
2. L. Jay, Y. Ma, Y. Wang, R. Bajaj, and F. Redekar, "Process and Material Challenges for 0.1-μm Copper Technology," presented at the 5th Int. Symp. on Chemical-Mechanical Polishing, Lake Placid, NY, August 13-16, 2000.
3. R. Bajaj, F. Redekar, and K. Wijekoon, "Unlocking the Damascene Puzzle," VMIC Conf., Santa Clara, Calif., June 2000.
4. S.V. Babu, K.C. Cadien, and H. Yano, eds., Chemical-Mechanical Polishing 2001-Advances and Future Challenges (Mater. Res. Soc. Symp. Proc. 671, Warrendale, PA, 2001).
5. S. Tsai, in Proc. IITC Conf. [CD-ROM] (IEEE Electron Devices Society, Piscataway, NJ, 2002) paper No. 5.2.
6. C.-C. Cheng, in Proc. IITC Conf. [CD-ROM] (IEEE Electron Devices Society, Piscataway, NJ, 2002) paper No. 12.4.
7. K.C. Yu, in Proc. IITC Conf. [CD-ROM] (IEEE Electron Devices Society, Piscataway, NJ, 2002) paper No. 2.1.
8. M.H. Tsai, S.W. Chou, C.L. Chang, C.H. Shieh, M.W. Lin, C.M. Wu, W.S. Shue, D.C. Yu, and M.S. Liang, in IEDM Tech. Dig. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 2001) paper No. 4.3.