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Volumn 59, Issue 6, 2005, Pages 690-693
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Chemical effects in chemical mechanical planarization of TaN: Investigation of surface reactions in a peroxide-based alkaline slurry using Fourier transform impedance spectroscopy
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Author keywords
CMP; Electronic materials; Impedance spectroscopy; Surfaces; Tantalum; Tantalum nitride
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Indexed keywords
COMPOSITE MATERIALS;
DIFFUSION;
ELECTRIC POTENTIAL;
ELECTROCHEMISTRY;
MICROPROCESSOR CHIPS;
PEROXIDES;
PH EFFECTS;
SEMICONDUCTOR MATERIALS;
SILICON WAFERS;
SPECTROSCOPIC ANALYSIS;
SPECTRUM ANALYSIS;
SURFACE ROUGHNESS;
THIN FILMS;
CHEMICAL MECHANICAL PLANARIZATION (CMP);
ELECTRONIC MATERIALS;
IMPEDANCE SPECTROSCOPIES;
TANTALUM NITRIDE;
TANTALUM COMPOUNDS;
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EID: 12244313915
PISSN: 0167577X
EISSN: None
Source Type: Journal
DOI: 10.1016/j.matlet.2004.11.010 Document Type: Article |
Times cited : (26)
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References (14)
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