Ultraviolet curing imprint lithography on flexible indium tin oxide substrates

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 24, Issue 3, 2006, Pages 1377-1383

  Chung, Y C ^a   Chiu, Y H ^b   Liu, H J ^c   Chang, Y F ^c   Cheng, C Y ^c   Hong, F C N ^c  

^a NATIONAL UNIVERSITY OF KAOHSIUNG   (Taiwan)

^b I SHOU UNIVERSITY   (Taiwan)

^c NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROLUMINESCENCE; IRRADIATION; LITHOGRAPHY; MASKS; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; ULTRAVIOLET RADIATION;

IMPRINT LITHOGRAPHY; INDIUM TIN OXIDE (ITO); LINEWIDTH SHRINKAGE; POLY(ETHYLENE TEREPHTHALATE) (PET); POLYMER CROSS LINKING;

INDIUM COMPOUNDS;

EID: 33744809815     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2200375     Document Type: Article

References (26)

1. J. Lewis, S. Grego, B. Chalamala, E. Vick, and D. Temple, Appl. Phys. Lett. 85, 3450 (2004).
2. C. N. de Carvalho, A. Luis, G. Lavareda, A. Amaral, P. Brogueira, and M. H. Godinho, Opt. Mater. (Amsterdam, Neth.) 17, 287 (2001).
3. X. Cheng, Y. T. Hong, J. Kanicki, and L. J. Guo, J. Vac. Sci. Technol. B 20, 2877 (2002).
4. G. Blanchet and J. Rogers, J. Imaging Sci. Technol. 47, 296 (2003).
5. F. M. Schellenberg, Future Fab Intl. 9 (2000); http://www.future-fab.com/ documents. asp?grID=213&d_ID=1202#
6. F. M. Schellenberg, Future Fab Intl. 9 (2000); http://www.future-fab.com/ documents. asp?grID=213&d_ID=1202#
7. M. Colbun, A. Grot, B. J. Choi, M. Amistoso, T. Bailey, S. V. Sreenivasan, J. G. Ekerdit, and C. G. Willson, J. Vac. Sci. Technol. B 19, 2162 (2001).
8. M. Colburn, T. Bailey, B. J. Choi, J. G. Ekerdt, S. V. Sreenivasan, and C. G. Willson, Solid State Technol. 44, 67 (2001).
9. M. Colburn, I. Suez, B. J. Choi, M. Meissi, T. Bailey, S. V. Sreenivasan, J. G. Ekerdt, and C. G. Willson, J. Vac. Sci. Technol. B 19, 2865 (2001).
10. T. C. Bailey et al., Microelectron. Eng. 61-62, 461 (2002).
11. S. Y. Chou, P. R. Krauss, and P. J. Renstrom, Appl. Phys. Lett. 67, 3114 (1995).
12. S. Y. Chou, P. R. Krauss, and P. J. Renstrom, Science 272, 85 (1996).
13. M. C. McAlpine, R. S. Friedman, and C. M. Lieber, Nano Lett. 3, 443 (2003).
14. P. Calvert, Chem. Mater. 13, 3299 (2001).
15. A. Kumar and G. Whitesides, Appl. Phys. Lett. 63, 2002 (1993).
16. M. Geissler, H. Schmid, A. Bietsch, B. Michel, and E. Delamarche, Langmuir 18, 2374 (2002).
17. X. D. Huang, L. R. Bao, X. Cheng, L. J. Guo, S. W. Pang, and A. F. Yee, J. Vac. Sci. Technol. B 20, 2872 (2002).
18. G. Y. Jung, W. Wu, Z. Li, S. Y. Wang, W. M. Tong, and R. S. Williams, NSTI-Nanotech 2005, Tech. Proc., Vol. 3, p. 256.
19. J. Comyn, Adhesion Science (Royal Society of Chemistry, Cambridge, 1997), pp. 98.
20. I. M. Chan and F. C. N. Hong, Thin Solid Films 44, 254 (2003).
21. A. A. Prabu and A. Alagar, Prog. Org. Coat. 49, 236 (2004).
22. B. Nabeth and J. F. Gerard, J. Appl. Polym. Sci. 60, 2113 (1996).
23. A. A. Stolov, T. Xie, J. Penelle, S. L. Hsu, and H. D. Stidham, Polym. Eng. Sci. 41, 314 (2001).
24. H. Lee and G. Y. Jung, Microelectron. Eng. 77, 42 (2005).
25. T. L. Breen, P. M. Fryer, R. W. Nunes, and M. E. Rothwell, Langmuir 18, 194 (2002).
26. L. Liu et al., Synth. Met. 91, 267 (1997).