Numerical and experimental study of the evolution of stresses in flip chip assemblies during assembly and thermal cycling

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 1001-1009

  Hanna, Carlton E ^a   Michaelides, Stylianos ^a   Palaniappan, Prema ^a   Baldwin, Daniel F ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; FLIP CHIP DEVICES; MATHEMATICAL MODELS; ORGANIC COMPOUNDS; RELIABILITY; STRESS ANALYSIS; SUBSTRATES; THERMAL CYCLING; THERMAL EXPANSION; THERMAL STRESS; THIN FILMS; VISCOELASTICITY;

COEFFICIENT OF THERMAL EXPANSION; FLIP CHIP ON BOARD; UNDERFILL;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0032667098     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (21)