Fatigue life prediction of flip-chips in terms of nonlinear behaviors of solder and underfill

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 141-148

  Qian, Zhengfang ^a   Lu, Minfu ^a   Ren, Wei ^a   Liu, Sheng ^a  

^a WAYNE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION; EUTECTICS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; SOLDERING; STRAIN; THERMAL CYCLING;

ABAQUS MATERIAL MODEL LIBRARY; INELASTIC STRAIN; NONLINEAR CONSTITUTIVE MODELING;

ELECTRONICS PACKAGING;

EID: 0032657603     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (28)