FEA modeling of FCOB assembly warpage and stresses due to underfill encapsulation and thermal cycling loading

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Pang, John H L ^a   Chong, Y R ^a   Sitaraman, Suresh K ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CREEP; ENCAPSULATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; SOLDERED JOINTS; STRESS ANALYSIS; THERMAL CYCLING; THERMAL EXPANSION; THERMAL STRESS;

COEFFICIENT OF THERMAL EXPANSION (CTE); FLIP CHIP ON BOARD (FCOB) PACKAGES;

ELECTRONICS PACKAGING;

EID: 0342298393     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Lau J.H., "Flip Chip Technologies", edited by John H. Lau, McGraw Hill,
2. Suranarayana D. et al., "Flip-chip Solder Bump Fatigue Life Enhanced by Polymer Encapsulation", Proc. 40th Electronic Component Technical Conference, Vol 1, pp.338-344, 1990
3. H.L.J. Pang, Y.T. Kwok and C.W. Seetoh "Temperature Cycling Fatigue Analysis of Fine Pitch Solder Joints", Proceeding of InterPACK '97, ASME
4. Darveaux R., Banerji K., "Constitutive relations for tin-based solder joints", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol 15, No 6, December 1992, pp 1013-1024.