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Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 41, Issue 4, 2002, Pages 1981-1985

Effects of the relationship between resistivity and additive chemistries in electrochemically deposited copper films

(2) Chen, Chia Fu a Lin, Kun Cheng a

a NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

Author keywords

Additive; Copper; Electroplated; Overpotential; Resistivity

Indexed keywords

ADDITIVES; ELECTRIC RESISTANCE; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; IMPURITIES; X RAY PHOTOELECTRON SPECTROSCOPY;

ADDITIVE CHEMISTRIES; COPPER FILM; CYCLIC VOLTAMMETRIC STRIPPING MEASUREMENTS;

ELECTROCHEMISTRY;

EID: 0036529467 PISSN: 00214922 EISSN: None Source Type: Journal
DOI: 10.1143/jjap.41.1981 Document Type: Article

Times cited : (9)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.