The laser in manufacture - its use in the soldering of electronic assemblies

Transactions of the Institute of Measurement & Control

Volumn 21, Issue 1, 1999, Pages 2-7

  Beckett, P M ^a   Fleming, A R ^a   Gilbert, J M ^a   Whitehead, D G ^a  

^a UNIVERSITY OF HULL   (United Kingdom)

Author keywords

diode lasers; electronics manufacture; Laser soldering

Indexed keywords

EID: 0002131495     PISSN: 01423312     EISSN: None     Source Type: Journal    
DOI: 10.1177/014233129902100101     Document Type: Article

References (7)

1. Beckett, P.M., Fleming, A.R., Foster, R.J., Gilbert, J.M., Polijanczuk, A.V., and Whitehead, D.G. 1994a. ‘An automated pick-place laser soldering process for electronics assembly’, Proc ECTC Washington, May (ISBN 0-7803-0914-6), pp. 1079–1081.
2. Beckett, P.M., Fleming, A.R., Foster, R.J., Gilbert, J.M., Polijanczuk, A.V., and Whitehead, D.G. 1994b. ‘Laser soldering - a thermal modelling approach’, Proc ISHM ‘94. November, Boston, Mass., pp. 613–618.
3. Beckett, P.M., Fleming, A.R., Gilbert, J.M., and Whitehead, D.G. 1997. ‘Practical application of laser soldering in electronics assembly’, IEEE Int Symp Industrial Electronics, July.
4. Bohman, C.F. 1974. ‘The laser and microsoldering’, Society of Manufacturing Engineers; Technical Paper No. AD74-810, Mich. 48128, p. 19.
5. DIOMED Ltd. The Jeffreys Building, Cowley Road, Cambridge, UK.
6. Lea, C. 1987. ‘Laser soldering of surface mount assemblies’, Hybrid Circuits, No. 12, p. 36.
7. Nichols, J., Musiejovsky, L., Semerad, E. 1992. Optimization of process parameters for laser soldering of surface mounted devices. IEEE Trans Comp, Hybrids, Manuf Technol 15, 1155.