Interaction kinetics between PBGA solder balls and Au/Ni/Cu metallisation during laser reflow bumping

Soldering and Surface Mount Technology

Volumn 15, Issue 2, 2003, Pages 17-21+9

  Tian, Yanhong ^a   Wang, Chunqing ^a   Zhang, Xiaodong ^a   Liu, Deming ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b ASM Assembly Automation Ltd   (Hong Kong)

Author keywords

Reflow; Solder

Indexed keywords

EUTECTICS; GOLD; LASER APPLICATIONS; LEAD COMPOUNDS; METALLIZING; NICKEL; REACTION KINETICS;

SOLDER BALLS;

SOLDERING ALLOYS;

EID: 0037591594     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910310479693     Document Type: Article

References (12)

1. Ferguson, M.E., Fieselman, C.D. and Elkins, M.A. (1997), "Manufacturing concerns when soldering with Au plated component leads or circuit board pads", IEEE Trans-CPMT-C, Vol. 20 No. 7, pp. 188-93.
2. Hayward, J.D. (1991), "Development of laser bonding as a manufacturing process for inner lead bonding", in Braren, B. (Ed.) Proceedings of SPIE, Lasers in Microelectronic Manufacturing, SPIE, Bellingham, USA, Vol. 1598, pp. 164-9.
3. Ho, C.E., Chen, Y.M. and Kao, C.R. (1999), "Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering", Journal of Electronic Materials, Vol. 28 No. 11, pp. 1231-8.
4. Ho, C.E., Tsai, S.Y. and Kao, C.R. (2001), "Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering", IEEE Transactions on Advanced Packaging, Vol. 24, pp. 493-8.
5. 4 in solder joints of ball grid array packages with the Au/Ni surface finish", Journal of Electronic Materials, Vol. 29 No. 10, pp. 1175-81.
6. Kim, P.G. and Tu, K.N. (1998), "Fast dissolution and soldering reactions on Au foils", Materials Chemistry and Physics, Vol. 53, pp. 165-71.
7. Lee, J.-H., Lee, Y.-H. and Kim, Y.-S. (2000a), "Fluxless laser reflow bumping of Sn-Pb eutectic solder", Scripta Materialia, Vol. 42 No. 8, pp. 789-93.
8. Lee, J.-H., Park, D. and Kim, Y.-S. (2000b), "Characteristics of the Pb-Sn eutectic solder bump formed via fluxless laser reflow soldering", Journal of Electronic Materials, Vol. 29 No. 10, pp. 1153-9.
9. Song, H.G., Ahn, J.P., Minor, A.M. and Morris, J.W. (2001), "Au-Ni-Sn intermetallic phase relationships in eutectic Pb-Sn solder formed on Ni/Au metallization", Journal of Electronic Materials, Vol. 30 No. 4, pp. 409-15.
10. Tian, Y., Wang, C. and Liu, D. (2002a), "Thermomechanical behavior of PBGA package during laser and hot air reflow soldering", The 4th International Symposium on Electronic Materials and Packaging 2002, 4-6 December, Taiwan.
11. Tian, Y., Wang, C., Ge, X., Liu, P. and Liu, D. (2002b), "Intermetallic compounds formation at interface between PBGA solder ball and Au/Ni/Cu/BT PCB substrate after laser reflow processes", Materials Science and Engineering: B, Vol. 95 No. 3, pp. 254-62.
12. Zribi, A., Chromik, R.R., Persthus, R., Teed, K. and Zavalij, L. (2000), "Solder metallization interdiffusion in microelectronic interconnects", IEEE Trans-CPMT-C, Vol. 23 No. 6, pp. 383-7.