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Journal of the Electrochemical Society

Volumn 149, Issue 1, 2002, Pages

Feature superfilling in copper electrochemical deposition

(3) Soukane, S a Sen, S a Cale, T S a

a RENSSELAER POLYTECHNIC INSTITUTE (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRODEPOSITION; FINITE DIFFERENCE METHOD; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT LAYOUT; REACTION KINETICS;

ELECTROCHEMICAL DEPOSITION (ECD);

COPPER;

EID: 0036229886 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.1426401 Document Type: Article

Times cited : (20)

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