Dishing effects during chemical mechanical polishing of copper in acidic media

Journal of the Electrochemical Society

Volumn 147, Issue 12, 2000, Pages 4639-4644

  Luo, Q ^a   Babu, S V ^b  

^a ROHM AND HAAS COMPANY   (United States)

^b Clarkson University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; CONCENTRATION (PROCESS); INORGANIC ACIDS; IRON COMPOUNDS; REDUCTION;

DISHING EFFECTS; MECHANICAL POLISHING;

COPPER;

EID: 0034500630     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1394116     Document Type: Article

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