-
1
-
-
0003958397
-
"Chemical Mechanical Polishing in Silicon Processing"
-
Li, S. H., and Miller, R. O., 2000, "Chemical Mechanical Polishing in Silicon Processing," Semicond. Semimetals, 63, pp. 1-4.
-
(2000)
Semicond. Semimetals
, vol.63
, pp. 1-4
-
-
Li, S.H.1
Miller, R.O.2
-
2
-
-
0003508875
-
-
John Wiley and Sons Inc., New York, N.Y
-
Steigerwald, J. M., Murarka, S. P., and Gutmann, R. J., 1985, Chemical Mechanical Planarization of Microelectronic Materials, John Wiley and Sons Inc., New York, N.Y.
-
(1985)
Chemical Mechanical Planarization of Microelectronic Materials
-
-
Steigerwald, J.M.1
Murarka, S.P.2
Gutmann, R.J.3
-
3
-
-
0003915324
-
"Interface Mechanics of Chemical Mechanical Polishing for Integrated-Circuit Planarization"
-
Ph.D., thesis, Georgia Institute of Technology, Atlanta, GA
-
Levert, J. L., 1997, "Interface Mechanics of Chemical Mechanical Polishing for Integrated-Circuit Planarization," Ph.D., thesis, Georgia Institute of Technology, Atlanta, GA.
-
(1997)
-
-
Levert, J.L.1
-
4
-
-
0032194467
-
2 Sielectric on Integrated Circuits"
-
2 Sielectric on Integrated Circuits," Tribol. Trans., 41(4), pp. 593-599.
-
(1998)
Tribol. Trans.
, vol.41
, Issue.4
, pp. 593-599
-
-
Levert, J.1
Baker, A.2
Mess, F.3
Danyluk, S.4
Salant, R.5
Cook, L.6
-
5
-
-
0034174259
-
"Mechanism for Subambient Interfacial Pressures While Polishing with Liquids"
-
Levert, J., Danyluk, S., and Tichy, J., 2000, "Mechanism for Subambient Interfacial Pressures While Polishing with Liquids," ASME J. Tribol., 122, p. 450.
-
(2000)
ASME J. Tribol.
, vol.122
, pp. 450
-
-
Levert, J.1
Danyluk, S.2
Tichy, J.3
-
6
-
-
0001611894
-
"The Theory and Design of Plate Glass Polishing Machines"
-
Preston, F. W., 1927, "The Theory and Design of Plate Glass Polishing Machines," J. Soc. Glass Technol., 11, pp. 214-217.
-
(1927)
J. Soc. Glass Technol.
, vol.11
, pp. 214-217
-
-
Preston, F.W.1
-
7
-
-
0006082395
-
"Pressure Distribution at the Silicon/Polishing Pad Interface"
-
Shan, L., Levert, J. L., and Danyluk, S., 1998, "Pressure Distribution at the Silicon/Polishing Pad Interface," Proc. of ASPE Spring Topical Meeting on Silicon Machining, pp. 96-100.
-
(1998)
Proc. of ASPE Spring Topical Meeting on Silicon Machining
, pp. 96-100
-
-
Shan, L.1
Levert, J.L.2
Danyluk, S.3
-
8
-
-
0034480717
-
"Interfacial Fluid Mechanics and Pressure Prediction in Chemical Mechanical Polishing"
-
Shan, L., Levert, J. L., Meade, L., Tichy, J. A., and Danyluk, S., 2000, "Interfacial Fluid Mechanics and Pressure Prediction in Chemical Mechanical Polishing," ASME J. Tribol., 122(3), pp. 539-543.
-
(2000)
ASME J. Tribol.
, vol.122
, Issue.3
, pp. 539-543
-
-
Shan, L.1
Levert, J.L.2
Meade, L.3
Tichy, J.A.4
Danyluk, S.5
-
9
-
-
0035422205
-
"Mechanical Interactions and Their Effects on Chemical Mechanical Polishing"
-
Shan, L., Zhou, C., and Danyluk, S., 2001, "Mechanical Interactions and Their Effects on Chemical Mechanical Polishing," IEEE Trans. Semicond. Manuf., 14(3), pp. 207-213.
-
(2001)
IEEE Trans. Semicond. Manuf.
, vol.14
, Issue.3
, pp. 207-213
-
-
Shan, L.1
Zhou, C.2
Danyluk, S.3
-
10
-
-
0041520530
-
"Pad Soaking Effect on Interfacial Fluid Pressure Measurements During CMP"
-
Ng, S. H., Hight, R., Zhou, C., Yoon, I., and Danyluk, S., 2003, "Pad Soaking Effect on Interfacial Fluid Pressure Measurements During CMP," ASME J. Tribol., 125(3), pp. 582-586.
-
(2003)
ASME J. Tribol.
, vol.125
, Issue.3
, pp. 582-586
-
-
Ng, S.H.1
Hight, R.2
Zhou, C.3
Yoon, I.4
Danyluk, S.5
-
11
-
-
85040875608
-
-
Cambridge University Press, Cambridge, U.K
-
Johnson, K. L., 1985, Contact Mechanics, Cambridge University Press, Cambridge, U.K.
-
(1985)
Contact Mechanics
-
-
Johnson, K.L.1
-
12
-
-
0000827365
-
"Contact of Nominally Flat Rough Surfaces"
-
Ser. A
-
Greenwood, J. A., and Williamson, J. B. P., 1966, "Contact of Nominally Flat Rough Surfaces," Proc. R. Soc. London, Ser. A, 295, pp. 300-319.
-
(1966)
Proc. R. Soc. London
, vol.295
, pp. 300-319
-
-
Greenwood, J.A.1
Williamson, J.B.P.2
-
14
-
-
0242322610
-
"Mechanical Modeling of the 2D Interfacial Slurry Pressure in CMP"
-
Higgs III, C. F., Ng, S. H., Yoon, I., Shan, L., Yap, L., and Danyluk, S., 2003, "Mechanical Modeling of the 2D Interfacial Slurry Pressure in CMP," Mater. Res. Soc. Symp. Proc., 767, pp. 305-312.
-
(2003)
Mater. Res. Soc. Symp. Proc.
, vol.767
, pp. 305-312
-
-
Higgs III, C.F.1
Ng, S.H.2
Yoon, I.3
Shan, L.4
Yap, L.5
Danyluk, S.6
-
15
-
-
15044350158
-
"A Mixed-Lubrication Approach to Predicting CMP Fluid Pressure: Modeling and Experiments"
-
submitted for publication
-
Higgs III, C. F., Ng, S. H., Borucki, L., and Danyluk, S., 2004, "A Mixed-Lubrication Approach to Predicting CMP Fluid Pressure: Modeling and Experiments," J. Electrochem. Soc., submitted for publication.
-
(2004)
J. Electrochem. Soc.
-
-
Higgs III, C.F.1
Ng, S.H.2
Borucki, L.3
Danyluk, S.4
-
16
-
-
0010906438
-
"Mechanical Interactions at the Interface of Chemical Mechanical Polishing"
-
Ph.D. thesis, Georgia Institute of Technology, Atlanta, GA
-
Shan, L., 2000, "Mechanical Interactions at the Interface of Chemical Mechanical Polishing," Ph.D. thesis, Georgia Institute of Technology, Atlanta, GA.
-
(2000)
-
-
Shan, L.1
-
17
-
-
0035555408
-
"A Multiscale Model for Chemical Mechanical Planarization"
-
Kim, A, T., Seok, J., Sukam, C., Tichy, J. A., and Cale, T. S., 2001, "A Multiscale Model for Chemical Mechanical Planarization," Advanced Metallization Conference, pp. 405-409.
-
(2001)
Advanced Metallization Conference
, pp. 405-409
-
-
Kim, A.T.1
Seok, J.2
Sukam, C.3
Tichy, J.A.4
Cale, T.S.5
-
18
-
-
84953648079
-
"Application of Finite Elastic Theory to the Deformation of Rubbery Materials"
-
Blatz, P. J., and Ko, W. L., 1962, "Application of Finite Elastic Theory to the Deformation of Rubbery Materials," Trans. Soc. Rheol., V1, pp. 223-251.
-
(1962)
Trans. Soc. Rheol.
, vol.6
, pp. 223-251
-
-
Blatz, P.J.1
Ko, W.L.2
-
19
-
-
15044343876
-
"An Analysis of Mixed Lubrication in Chemical Mechanical Polishing"
-
(accepted)
-
Ng, S. H., Higgs, III, C. F., Yoon, I., and Danyluk, S., 2004, "An Analysis of Mixed Lubrication in Chemical Mechanical Polishing," ASME J. Tribol., (accepted).
-
(2004)
ASME J. Tribol.
-
-
Ng, S.H.1
Higgs III, C.F.2
Yoon, I.3
Danyluk, S.4
-
20
-
-
15044343449
-
"Wafer Bending Experiments Chemical Mechanical Polishing"
-
submitted for publication
-
Ng, S. H., Yoon, L, Higgs, III, C. F., and Danyluk, S., 2004, "Wafer Bending Experiments Chemical Mechanical Polishing," J. Electrochem. Soc., submitted for publication.
-
(2004)
J. Electrochem. Soc.
-
-
Ng, S.H.1
Yoon, L.2
Higgs III, C.F.3
Danyluk, S.4
|