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Volumn 127, Issue 1, 2005, Pages 198-205

Tilt and interfacial fluid pressure measurements of a disk sliding on a polymeric pad

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; DISKS (MACHINE COMPONENTS); FLUID MECHANICS; LUBRICATION; MAPPING; MATHEMATICAL MODELS; PRESSURE EFFECTS;

EID: 15044360276     PISSN: 07424787     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1829718     Document Type: Article
Times cited : (13)

References (20)
  • 1
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  • 3
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    • Ph.D., thesis, Georgia Institute of Technology, Atlanta, GA
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  • 5
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    • "Mechanism for Subambient Interfacial Pressures While Polishing with Liquids"
    • Levert, J., Danyluk, S., and Tichy, J., 2000, "Mechanism for Subambient Interfacial Pressures While Polishing with Liquids," ASME J. Tribol., 122, p. 450.
    • (2000) ASME J. Tribol. , vol.122 , pp. 450
    • Levert, J.1    Danyluk, S.2    Tichy, J.3
  • 6
    • 0001611894 scopus 로고
    • "The Theory and Design of Plate Glass Polishing Machines"
    • Preston, F. W., 1927, "The Theory and Design of Plate Glass Polishing Machines," J. Soc. Glass Technol., 11, pp. 214-217.
    • (1927) J. Soc. Glass Technol. , vol.11 , pp. 214-217
    • Preston, F.W.1
  • 8
    • 0034480717 scopus 로고    scopus 로고
    • "Interfacial Fluid Mechanics and Pressure Prediction in Chemical Mechanical Polishing"
    • Shan, L., Levert, J. L., Meade, L., Tichy, J. A., and Danyluk, S., 2000, "Interfacial Fluid Mechanics and Pressure Prediction in Chemical Mechanical Polishing," ASME J. Tribol., 122(3), pp. 539-543.
    • (2000) ASME J. Tribol. , vol.122 , Issue.3 , pp. 539-543
    • Shan, L.1    Levert, J.L.2    Meade, L.3    Tichy, J.A.4    Danyluk, S.5
  • 9
    • 0035422205 scopus 로고    scopus 로고
    • "Mechanical Interactions and Their Effects on Chemical Mechanical Polishing"
    • Shan, L., Zhou, C., and Danyluk, S., 2001, "Mechanical Interactions and Their Effects on Chemical Mechanical Polishing," IEEE Trans. Semicond. Manuf., 14(3), pp. 207-213.
    • (2001) IEEE Trans. Semicond. Manuf. , vol.14 , Issue.3 , pp. 207-213
    • Shan, L.1    Zhou, C.2    Danyluk, S.3
  • 10
    • 0041520530 scopus 로고    scopus 로고
    • "Pad Soaking Effect on Interfacial Fluid Pressure Measurements During CMP"
    • Ng, S. H., Hight, R., Zhou, C., Yoon, I., and Danyluk, S., 2003, "Pad Soaking Effect on Interfacial Fluid Pressure Measurements During CMP," ASME J. Tribol., 125(3), pp. 582-586.
    • (2003) ASME J. Tribol. , vol.125 , Issue.3 , pp. 582-586
    • Ng, S.H.1    Hight, R.2    Zhou, C.3    Yoon, I.4    Danyluk, S.5
  • 11
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    • Johnson, K.L.1
  • 12
    • 0000827365 scopus 로고
    • "Contact of Nominally Flat Rough Surfaces"
    • Ser. A
    • Greenwood, J. A., and Williamson, J. B. P., 1966, "Contact of Nominally Flat Rough Surfaces," Proc. R. Soc. London, Ser. A, 295, pp. 300-319.
    • (1966) Proc. R. Soc. London , vol.295 , pp. 300-319
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  • 15
    • 15044350158 scopus 로고    scopus 로고
    • "A Mixed-Lubrication Approach to Predicting CMP Fluid Pressure: Modeling and Experiments"
    • submitted for publication
    • Higgs III, C. F., Ng, S. H., Borucki, L., and Danyluk, S., 2004, "A Mixed-Lubrication Approach to Predicting CMP Fluid Pressure: Modeling and Experiments," J. Electrochem. Soc., submitted for publication.
    • (2004) J. Electrochem. Soc.
    • Higgs III, C.F.1    Ng, S.H.2    Borucki, L.3    Danyluk, S.4
  • 16
    • 0010906438 scopus 로고    scopus 로고
    • "Mechanical Interactions at the Interface of Chemical Mechanical Polishing"
    • Ph.D. thesis, Georgia Institute of Technology, Atlanta, GA
    • Shan, L., 2000, "Mechanical Interactions at the Interface of Chemical Mechanical Polishing," Ph.D. thesis, Georgia Institute of Technology, Atlanta, GA.
    • (2000)
    • Shan, L.1
  • 18
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  • 19
    • 15044343876 scopus 로고    scopus 로고
    • "An Analysis of Mixed Lubrication in Chemical Mechanical Polishing"
    • (accepted)
    • Ng, S. H., Higgs, III, C. F., Yoon, I., and Danyluk, S., 2004, "An Analysis of Mixed Lubrication in Chemical Mechanical Polishing," ASME J. Tribol., (accepted).
    • (2004) ASME J. Tribol.
    • Ng, S.H.1    Higgs III, C.F.2    Yoon, I.3    Danyluk, S.4
  • 20
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    • "Wafer Bending Experiments Chemical Mechanical Polishing"
    • submitted for publication
    • Ng, S. H., Yoon, L, Higgs, III, C. F., and Danyluk, S., 2004, "Wafer Bending Experiments Chemical Mechanical Polishing," J. Electrochem. Soc., submitted for publication.
    • (2004) J. Electrochem. Soc.
    • Ng, S.H.1    Yoon, L.2    Higgs III, C.F.3    Danyluk, S.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.