Flip chip solder joint fatigue life model investigation

Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002

Volumn , Issue , 2002, Pages 107-114

  Yeo, A ^a   Lee, C ^a   Pang, J H L ^b  

^a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CREEP; ELASTOPLASTICITY; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; FATIGUE TESTING; FINITE ELEMENT METHOD; FORECASTING; LEAD; TIN;

CREEP-FATIGUE MODELS; EXPERIMENTAL TESTING; FATIGUE LIFE PREDICTION; FLIP CHIP SOLDER JOINTS; MATERIAL CONSTITUTIVE MODELS; MEAN TIME TO FAILURE; THERMAL CYCLIC TESTS; VOLUME AVERAGING METHOD;

FLIP CHIP DEVICES;

EID: 84964636376     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2002.1185607     Document Type: Conference Paper

References (20)

1. Lau, J. H., "Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies", McGraw-Hill, New York, 2000
2. John H. Lau and Yi-Hsin Pao, "Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies", McGraw-Hall, New York, 1997
3. W.W.Lee, L.T. Nguyen & G.S. Selvaduray, "Solder Joint Fatigue Model: Review and Applicability to Chip Scale Packages", Journal of Microelectronics Reliability, 2000
4. H. L. J. Pang, C. W. Seetoh & Z. P. Wong, "CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis", ASME Journal of Electronic Packaging, September 2000, Vol. 122, Page 255-261
5. X. Q. Shi, Z. P. Wang, H. L. J. Pang, & W. Zhou, "A Modified Energy-Based Low Cycle Fatigue Model for Eutectic Solder Alloy", Scripta Materialia, Vol. 114, No.2, (1999)
6. rd EPTC2000, Singapore.
7. th ECTC, Las Vegas, Nevada, May 1999
8. Vadim Gektin, Avram Bar-Cohen & Jeremy Ames, "Coffin-Manson Fatigue Model of Underfilled Flip-Chips" IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol.20, No.3, September 1997
9. Werner Engelmaier, "Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling" IEEE Transactions on Components, Hybrids, and Manufacturing Technology - Vol.6, No.3, September 1983
10. Harvey D. Solomon, "Fatigue of 60/40 Solder" IEEE Transactions on Components, Hybrids, and Manufacturing Technology - Vol.9, No.4, December 1986
11. Sheera Knecht & L.R. Fox, "Constitutive Relation and Creep-Fatigue Life Model for Eutectic Tin-Lead Solder", IEEE Transactions on Components, Hybrids, and Manufacturing Technology - Vol.13, No.2, June 1990
12. th ECTC, Las Vegas, Nevada, May 2000
13. G. Z. Wang, Z. N Cheng, K. Becker & J. Wilde, "Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys", Journal of Electronic Packaging, Transactions of the ASME, Vol.123, pp247-253, September 2001.
14. Rakesh K. Agarwal et al., "Thermal Cycling and Thermal Shock for FCOB Testing", Journal of Electronic Packaging, Transactions of the ASME, Vol.2, pp1929-1933, 1999.
15. nd ECTC, Las Vegas, Nevada, May 2001
16. X. Zhang, S-W. Ricky Lee & Yi-Hsin Pao, "A Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints" Journal of Electronic Packaging, Transactions of the ASME, Vol.122, pp200-206, September 2000.
17. X. Q. Shi, Z. P. Wang, H. L. J. Pang, & W. Zhou, "Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy", Journal of Electronic Packaging, Transactions of the ASME, Vol.121, pp179-185, September 1999.
18. Darveaux R., Kingshuk Banerji, "Constitutive Relations for Tin-Based Solder Joints", IEEE Transaction on Components, Hybrids, and Manufacturing Technology, Vol.15, No.6 (1992)
19. JEDEC Standard, JESD22-A104-B, Temperature Cycling, July 2000
20. ANSYS User Manual (V6.0)