Gas pressurized hot embossing for transcription of micro-features

Microsystem Technologies

Volumn 10, Issue 1, 2003, Pages 76-80

  Chang, J H ^a   Yang, S Y ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

GASES; HIGH TEMPERATURE OPERATIONS; MICROELECTRONIC PROCESSING; PRESSURE DISTRIBUTION; PRESSURIZATION; SILICON WAFERS; SUBSTRATES; THERMOPLASTICS;

GAS PRESSURIZED HOT EMBOSSING; MICRO-FEATURES;

FINISHING;

EID: 0742268922     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-003-0311-1     Document Type: Article

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