Tensile stress in hard metal films

Applied Physics Letters

Volumn 83, Issue 16, 2003, Pages 3287-3289

  Janssen, G C A M ^a   Dammers, A J ^b   Sivel, V G M ^b   Wang, W R ^b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b NETHERLANDS INSTITUTE FOR METALS RESEARCH   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; CRYSTAL MICROSTRUCTURE; GRAIN BOUNDARIES; GRAIN GROWTH; RECRYSTALLIZATION (METALLURGY); TENSILE STRESS; THERMAL EXPANSION; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

INTERATOMIC DISTANCE;

METALLIC FILMS;

EID: 0242411484     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1619561     Document Type: Article

References (14)

1. F. M. D'Heurle, Metall. Trans. 1, 725 (1970).
2. F. A. Doljack and R. W. Hoffman, Thin Solid Films 12, 71 (1972).
3. R. W. Hoffman, Thin Solid Films 34, 185 (1976).
4. W. C. Leslie and E. Hornbogen, in Physical Metallurgy, 4th ed., edited by R. W. Cahn and P. Haasen (North Holland, Amsterdam, 1996).
5. E. S. Machlin, Materials Science in Microelectronics (Giro, Croton-on- Hudson, NY, 1995).
6. C. V. Thompson and R. Carel, J. Mech. Phys. Solids 44, 657 (1996).
7. A. Misra, H. Kung, T. E. Mitchell, and M. Nastasi. J. Mater. Res. 15, 756 (2000).
8. P. A. Flinn, D. S. Gardner, and W. D. Nix, IEEE Trans. Electron Devices ED-34, 689 (1987).
9. C. Tang, S. Alexander, and R. Bruinsma, Phys. Rev. Lett. 64, 772 (1990).
10. A. J. Dammers and S. Radelaar, Mater. Sci. Forum 94-96, 345 (1992).
11. J. M. Thijssen, H. J. F. Knops, and A. J. Dammers, Phys. Rev. B 45, 8650 (1992).
12. J. M. Thijssen, Phys. Rev. B 51, 1985 (1995).
13. Paritosh. D. J. Srolovitz, C. C. Bataile, X. Li, and J. E. Butler, Acta Mater. 47, 2269 (1999).
14. G. Simmons and H. Wang, Single Crystal Elastic Constants and Calculated Aggregate Properties, (M.I.T. Press. Cambridge, MA, 1971).